专利名称：Flip chip chip-scale package舒心苑
春季班
发明人：Hsing-Seng Wang
申请号：US09413047
申请日：19991006
公开号：US06255140B1
公开日：
20010703
配送服务专利内容由知识产权出版社提供
专利附图：
摘要：A miconductor flip chip chip-scale package that includes a metal heat slug bonded to the surface of a miconductor chip. The heat slug protects the chip from being damaged as well as assists heat dissipation. Openings may also be formed on the heat slug to provide better air flow for cooling. A first packaging process for the chip-scale packages bonds a single heat slug to each miconductor chip on a substrate panel.
画花怎么画A cond packaging process bonds a long heat slug comprising a plurality of connected heat slugs to the miconductor substrate panel at the same time. Conventional五台山五爷庙简介
packaging equipment can be ud for both packaging process to manufacture the chip-scale pack
ages.
仓王爷申请人：INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
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