PECVD OXIDE-NITRIDE AND OXIDE-SILICON STACKS FOR 3

更新时间:2023-06-25 15:51:41 阅读: 评论:0

专利名称:PECVD OXIDE-NITRIDE AND OXIDE-SILICON STACKS FOR 3D MEMORY APPLICATION
发明人:RAJAGOPALAN, Nagarajan,HAN,
输出英文
女性表白日139信箱Xinhai,PARK, J, Ae,KIYOHARA,
Tsutomu,PARK, Sohyun,KIM, Bok, Hoen
申请号:US2011/053730曹冲怎么死的>微信号怎么加好友
申请日:20110928
公开号:WO2012/047697A3
公开日:
中国象棋对弈
20120628
专利内容由知识产权出版社提供
专利附图:
摘要:A layer stack of different materials is deposited on a substrate in a single
考作文plasma enhanced chemical vapor deposition processing chamber while maintaining a vacuum. A substrate is placed in the processing chamber and a first processing gas is ud to form a first layer of a first material on the substrate. A plasma purge and gas purge are performed before a cond processing gas is ud to form a cond layer of a cond material on the substrate. The plasma purge and gas purge are repeated and the additional layers of first and cond materials are deposited on the layer stack.
申请人:APPLIED MATERIALS, INC.,RAJAGOPALAN, Nagarajan,HAN, Xinhai,PARK, J, Ae,KIYOHARA, Tsutomu,PARK, Sohyun,KIM, Bok, Hoen
地址:95054 US,95054 US,94538 US,95054 US,95008 US,95051 US,95120 US
国籍:US,US,US,US,US,US,US
代理人:DERGOSITS, Michael, E.四川武警警官学院
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