专利名称：INTERCONNECT ARRAY PATTERN WITH A
3:1 SIGNAL-TO-GROUND RATIO
发明人：Zhaoqing Chen,Matteo Cocchini,Rohan U.
Mandrekar,Tingdong Zhou什么叫表达方式
相机美颜申请号：US14824125
申请日：20150812
公开号：US20160149611A1
公开日：
南柱赫图片
20160526
专利内容由知识产权出版社提供
专利附图：
代表颜色的词语摘要：An electronic device including a plurality of interconnects are orthogonally arranged in a grid pattern and evenly spaced by a first distance, the plurality of嗔是什么意思
interconnects include: a first conductor pair with conductors arranged next to each other in a first direction, the first direction is oriented diagonally relative to the orthogonal grid pattern, a cond conductor pair with conductors arranged next to each other in a cond direction substantially perpendicular to the first direction, each conductor of the cond conductor pair is spaced by the first distance from each signal conductor of the first conductor pair, and a third conductor pair with conductors arranged next to each other in a third direction substantially parallel to the first direction, each conductors of the third conductor pair is spaced by the first distance from one of the signal elements of the cond conductor pair.
白水牛角梳
申请人：International Business Machines Corporation无线光猫
地址：Armonk NY US
什么音乐好听国籍：US
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