3
Scotch-W eld TM
Epoxy Adhesives
DP190 Translucent and Gray
Product Description3M™Scotch-Weld™Epoxy Adhesive DP190 Translucent is a 1:1 mix ratio similar to
3M™Scotch-Weld™Epoxy Adhesive 2216 B/A Translucent but faster curing.
3M™Scotch-Weld™Epoxy Adhesive DP190 Gray is a 1:1 by volume mix ratio of
3M™Scotch-Weld™Epoxy Adhesive 2216 B/A Gray and exhibits good peel, shear
and environmental aging properties.
Available in bulk containers as 3M™Scotch-Weld™Epoxy Adhesive 2216 B/A.
Features•90 minute worklife•High shear and peel strength
•Flexible•1:1 mix ratio
•Translucent or gray color
Typical Uncured Physical Properties Note:The following technical information and data should be considered reprentative or typical only and should not be ud for specification purpos.
Scotch-Weld Scotch-Weld
Epoxy Adhesive Epoxy Adhesive
DP190 Translucent DP190 Gray Ba Resins Epoxy/Amine Epoxy/Amine Viscosity1, Approximate Ba (B)2,000-8,000 cps75,000-150,000 cps @ 75°F Accelerator (A)7,000-15,000 cps40,000-80,000 cps Net Weight Ba (B)9.3-9.711.0-11.4 (Lbs./gal.)Accelerator (A)8.2-8.610.6-11.0 Color Ba (B)Clear White (Lbs./gal.)Accelerator (A)Amber Gray
Mix Ratio (B:A)By Volume1:11:1
By Weight 1.15:1 1.06:1 Worklife2 2 gram80 min.—
@ 73°F (23°C)20 gram60 min.90 min. Footnotes:
1.Viscosity determined using 3M test method C-1D. Procedure involves Brookfield RVF, #7 spindle, 20 rpm and 80°F (26°C).
Measurement taken after 1 minute rotation.
2.Worklife determined using 3M test method C-3180. Procedure involves periodically measuring a 2 gram mixed mass for lf-
leveling and wetting properties. This time will also approximate the usable worklife in an 3M™EPX™Applicator mixing nozzle.
3M ™Scotch-W eld ™
似造句Epoxy Adhesives
DP190 Translucent and Gray
- 2 -
Typical Cured Properties
3M™Scotch-Weld™3M™Scotch-Weld™Epoxy Adhesive Epoxy Adhesive DP190 Translucent
DP190 Gray
Color
T ranslucent
Gray
Hardness (ASTM D 2240)Shore D 3560Worklife 2
80 minutes 90 minutes Tack-free Time 3
~ 4 hrs ~ 6 hrs Time to Handling Strength 4 6 hrs 8-12 hrs Full Cure Time 514 days 7 days Elongation 6
120%30%Tensile Strength 6
摆脱贫困读后感2750 psi
3500 psi
Physical
Scotch-Weld Scotch-Weld Epoxy Adhesive Epoxy Adhesive DP190 Translucent DP190 Gray Weight Loss by Thermal Gravimetric 1% @ 390°F (199°C)1% @ 477°F (247°C)Analysis (TGA)7
5% @ 594°F (312°C)
5% @ 639°F (337°C)
Thermal Coefficient of Expansion (TCE)by TMA 8(∞x 10-6units/unit/°C)
Below Tg
86 (41-68°F 62 (41-68°F [5-20°C] range)[5-25°C] range)Above Tg
166 (167-284°F 177 (167-284°F [75-140°C] range)[65-140°C] range)
Glass Transition Temperature (Tg) by DCS 9
Ont 50°F (10°C)45°F (7°C)Mid-Point
80°F (27°C)68°F (20°C)
Thermal Conductivity 10
(@ 110°F on .250 in. samples)
BTU - ft./ft.2- hr. - °F).079.220Cal./c. - cm - °C).39 x 10-3
90.9 x 10-2
Watt/m - °C
.136.381Thermal Shock Resistance 11
Potted Washer Olyphant Test Pass 5 cycles Pass 5 cycles (3M ITSD Test Method C-3174without cracking
without cracking
+100°C [air] to -50°C [liquid])
Thermal
Scotch-Weld Scotch-Weld Epoxy Adhesive Epoxy Adhesive DP190 Translucent
无花果瘦肉汤
DP190 Gray
Dielectric Constant @ 1 KH Z @ 73°F (23°C)
来自韩国的女人6.2
6.5
(ASTM D 150)
Dissipation Factor @ 1 KH Z @ 73°F (23°C)
0.160.09(ASTM D 150)
Dielectric Strength
875 volts/mil 830 volts/mil (ASTM D 149)Sample Thickness Approx. 30 mil.
Volume Resistivity
7.5 x 1010ohm-cm
5.0 x 1012ohm-cm
(ASTM D 257)
Electrical
Note:The following technical information and data should be considered reprentative
or typical only and should not be ud for specification purpos.
Footnotes:
3.T ack-free time determined per 3M
test method C-3173. Involves dispensing 0.5 gram amount of adhesive onto substrate and testing periodically for no
adhesive transfer to metal spatula.4.Handling strength determined per
3M test method C-3179. Time to handling strength taken to be that required to achieve a 50 psi OLS strength using aluminum substrates.5.The cure time is defined as that
time required for the adhesive to achieve a minimum of 80% of the ultimate strength as measured by aluminum-aluminum OLS.6.T ensile and Elongation. Udwps目录生成
procedure in 3M test method C-3094/A TSM D 882. Samples were 2 in. dumbbells with .k and .030 in. sample
thickness. Separation rate was 2inches per minute. Samples cured 2 hrs RT plus 2 hrs/ 160°F (71°C).7.Weight loss by TGA reported as
that temperature at which 5%weight loss occurs by TGA in air at 5°C ri per minute per ASTM 1131-86.8.TCE determined using TMA
Analyzer using a heating rate of 50°F (10°C) per minute. Second heat values given.9.Glass T ransition T emperature (Tg)
determined using DSC Analyzer with a heating rate of 68°F (20°C)per minute. Second heat values given.10.Thermal conductivity determined
using ASTM C177 and C-matic Instrument using 2 in. diameter samples.11.Thermal shock resistance run per
3M test method C-3174. Involves potting a metal washer into a 2 in.x 0.5 in. thick ction and cycling this test specimen to colder and colder temperatures.
3M ™Scotch-W eld ™
Epoxy Adhesives
DP190 Translucent and Gray
- 3 -
Typical Adhesive Performance Characteristics
3M™Scotch-Weld™3M™Scotch-Weld™Epoxy Adhesive Epoxy Adhesive DP190 Translucent
DP190 Gray
Etched Aluminum 1800 psi 2500 psi Sanded Aluminum (60 grit)850 psi 1500 psi Cold Rolled Steel 850 psi 1400 psi Wood, Fir 650 psi 1100 psi Glass, Borosilicate
260 psi 300 psi Glass, +3M™Scotch-Weld™Primer 3901300 psi 300 psi Polycarbonate 400 psi 800 韩国鸟叔
psi Acrylic 350 psi 500 psi Fiberglass 1000 psi 1600 psi ABS 400 psi 700 psi PVC
650 psi 800 psi Polypropylene
90 psi
50 psi
Overlap Shear Strength (OLS) to 12
(Bonds cured 24 hrs @ RT + 2 hrs 160°F [71°C])
The following product performance data were obtained in the 3M laboratory under the conditions specified. The following data show typical results obtained with the 3M™Scotch-Weld™Adhesives when applied to properly prepared substrates, cured,and tested according to the specifications indicated. The data were generated using the 3M™EPX™Applicator System equipped with an EPX applicator static mixer,according to manufacturer’s directions. Thorough hand mixing should afford comparable results.
Note:The following technical information and data should be considered reprentative
or typical only and should not be ud for specification purpos.
Scotch-Weld Scotch-Weld Epoxy Adhesive Epoxy Adhesive DP190 Translucent
DP190 Gray
1 hr @ RT 10 psi 10 psi 6 hrs @ RT 200 psi 50 psi 24 hrs @ RT 800 psi 1000 psi 7 days @ RT 1200 psi 2000 psi 1 mo @ RT 1800 psi 2200 psi 3 mos @ RT
1800 psi
2500 psi
Rate of Strength Buildup
(OLS on Etched Aluminum)12Bonds tested after:
Footnotes:
12.Overlap shear (OLS) strengths were measured on 1 in. wide 1/2 in. overlap specimens. The bonds were made
individually using 1 in. x 4 in. pieces of substrate. The thickness of the bond line was 0.005-0.008 in. All strengths were measured at 70°F (21°C) except were noted. (Test per ASTM D 1002-72.)
The paration rate of the testing jaws was 0.1 in. per minute for metals, 2 in. per minute for plastics and 20 in. per minute for rubbers. The thickness of the substrates were: steel, 0.060 in.; other metals, 0.05-0.064 in.; rubber, 0.125 in.; plastics,0.125 in.
3M ™Scotch-W eld ™
Epoxy Adhesives
DP190 Translucent and Gray
- 4 -
Typical Adhesive Performance Characteristics (continued)
Scotch-Weld Epoxy Adhesive
Scotch-Weld Epoxy Adhesive
DP190 Translucent
DP190 Gray
-67°F (-55°C)3500 psi 1500 psi 70°F (21°C)1200 psi 2500 psi 120°F (49°C)290 psi 1000 psi 150°F (66°C)200 psi 600 psi 180°F (82°C)
160 psi
400 psi
Overlap Shear Strength vs Temperature 12
(Bonds cured 24 hr @ RT + 2 hrs @ 160°F [71°C]) Bonds tested at:
Scotch-Weld Epoxy Adhesive
Scotch-Weld Epoxy Adhesive
DP190 Translucent
DP190 Gray
-67°F (-55°C) 3 piw 3 piw 70°F (21°C 20 piw 20 piw 120°F (49°C) 3 piw 10 piw 150°F (66°C) 2 piw 4 piw 180°F (82°C)
1 piw
2 piw
180°F Peel Strength vs Temperature 12
(Bonds cured 24 hr @ RT + 4 hrs @ 160°F [71°C]) Bonds tested at:
Scotch-Weld Epoxy Adhesive
Scotch-Weld Epoxy Adhesive
DP190 Translucent
DP190 Gray
Acetone A/A A/A Isopropyl Alcohol A/A A/A Freon TF A/A A/A Freon TMC A/B A/A 1,1,1-T richlorethane A/A A/A RMA Flux
A/A
A/A
Key: A - Unaffected, B - Slight Attack, C - Moderate/Severe Attack
Solvent Resistance 13One Hour/One Month
One Hour/One Month
3M™Scotch-Weld™3M™Scotch-Weld™Epoxy Adhesive Epoxy Adhesive DP190 Translucent
DP190 Gray
24 hrs RT + 2 hrs @ 160°F (71°C)1700 psi 2500 psi 24 hrs RT + 2 hrs @ 240°F (115°C)3200 psi 3000 psi 1 wk RT + wk @ 90°F/90% RH 1400 psi 2400 psi 1 wk RT + 1 wk 248°F (120°C)3500 psi 3500 psi 1 wk RT + 1 wk H 2O Immersion
1700 psi
2500 psi
Environmental Aging
(OLS on Etched Aluminum)12Bonds tested after:
Note:The following technical information and data should be considered reprentative
or typical only and should not be ud for specification purpos.
Footnotes:
12.Overlap shear (OLS) strengths
were measured on 1 in. wide 1/2in. overlap specimens. The bonds were made individually using 1 in. x 4 in. pieces of substrate. The thickness of the bond line was 0.005-0.008 in. All strengths were measured at 70°F (21°C) except were noted. (T est per ASTM D 1002-72.)
The paration rate of the testing jaws was 0.1 in. per minute for metals, 2 in. per minute for plastics and 20 in. per minute for rubbers.The thickness of the substrates were: steel, 0.060 in.; other metals, 0.05-0.064 in.; rubber,0.125 in.; plastics, 0.125 in.13.Solvent resistance was determined
using cured (24 hrs RT + 2 hrs 160°F [71°C] samples (1/2 in. x 4in. x 1/8 in. thickness) immerd in the test solvent for 1 hour and 1month. After the allotted period of time the sample was removed and visually examined for surface
attack as compared to the control.
3M ™Scotch-W eld ™
Epoxy Adhesives
DP190 Translucent and Gray
- 5 -
3M ™EPX ™
Pneumatic Applicator Delivery Rates
6mm Nozzle 10mm Nozzle Adhesive*
gms/minute
gms/minute
3M™Scotch-Weld™Epoxy Adhesive DP190 Gray
11.9
46.0
200 ml Applicator – Maximum Pressure 58 psi
1/4 in. Nozzle Adhesive*
gms/minute
3M™Scotch-Weld™Epoxy Adhesive 112
DP190 Translucent
Scotch-Weld epoxy adhesive DP190 Gray 16.9
Scotch-Weld epoxy adhesive DP190 Gray
21.5 (nozzle cut back 2 divisions)Scotch-Weld epoxy adhesive DP190 100°F (38°C)
41.1
50 ml Applicator – Maximum Pressure 50 psi
*Tests were run at a temperature of 70°F ±2°F (21°C ±1°C) and at maximum applicator pressure.
Handling/Curing Information
Directions For U
1.For high strength structural bonds, paints, oxide films, oils, dust, mold relea agents and all other surface contaminants must be completely removed. However, the amount of surface preparation necessary directly depends on the required bond strength and the environmental aging resistance desired by the ur. For suggested surface preparations on common substrates, e the ction on surface preparation.
2.Mixing
不屈不挠的近义词For Duo Pak Cartridges
摩羯座的致命弱点
3M™Scotch-Weld™Epoxy Adhesives DP190 Translucent and DP190 Gray are supplied in a dual syringe plastic duo-pak cartridge as part of the 3M™EPX™Applicator system.To u, simply inrt the duo-pak cartridge into the EPX applicator and start the plunger into the cylinders using light pressure on the trigger. Next, remove the duo-pak cartridge cap and expel a small amount of adhesive to be sure both sides of the duo-pak cartridge are flowing evenly and freely. If automatic mixing of Part A and Part B is desired, attach the EPX applicator mixing nozzle to the duo-pak cartridge and begin dispensing the adhesive.For hand mixing, expel the desired amount of adhesive and mix thoroughly. Mix approximately 15 conds after uniform color is obtained.For Bulk Containers
Mix thoroughly by weight or volume in the proportions specified in the typical uncured properties ction. Mix approximately 15 conds after uniform color is obtained.3.For maximum bond strength, apply adhesive evenly to both surfaces to be joined.
4.Application to the substrates should be made within 75 minutes. Larger quantities and/or higher temperatures will reduce this working time.
5.Join the adhesive coated surfaces and allow to cure at 60°F (16°C) or above until
completely firm. Heat up to 200°F (93°C) will speed curing. The products will cure in 7 to 14 days @ 75°F (24°C).
6.Keep parts from moving during cure. Contact pressure necessary. Maximum shear strength is obtained with a 3-5 mil bond line.
7.Excess uncured adhesive can be cleaned up with ketone type solvents.*
*Note: When using solvents, extinguish all ignition sources, including pilot lights, and follow
manufacturer’s precautions and directions for u.
Adhesive Coverage (typical): A 0.005 in. thick bondline will yield a coverage of
320 sq. ft./gallon.
3M ™Scotch-W eld ™
Epoxy Adhesives
DP190 Translucent and Gray
- 6 -
Surface Preparation
For high strength structural bonds, paint, oxide films, oils, dust, mold relea agents and all other surface contaminants must be completely removed. However, the amount of surface preparation necessary directly depends on the required bond strength and the environmental aging resistance desired by the ur.
The following cleaning methods are suggested for common surfaces:
Steel:
1.Wipe free of dust with oil-free solvent such as acetone, isopropyl or alcohol solvents.*
2.Sandblast or abrade using clean fine grit abrasives.
3.Wipe again with solvent to remove loo particles.
4.If a primer is ud, it should be applied within 4 hours after surface preparation. Aluminum:
1.Alkaline Degrea: Oakite 164 solution (9-11 oz./gallon water) at 190°F (87°C) ±10°F for 10-20 minutes. Rin immediately in large quantities of cold running water.*
2.Acid Etch: Place panels in the following solution for 10 minutes at 150°F (65°C) ±5°F.*
Sodium Dichromate 4.1 - 4.9 oz./gallon Sulfuric Acid, 66°Be 38.5 - 41.5 oz./gallon 2024-T3 aluminum (dissolved)0.2 oz./gallon minimum Tap water as needed to balance
3.Rin: Rin panels in clear running tap water.
4.Dry: Air dry 15 minutes; force dry 10 minutes at 150°F (65°C) ±10°F.
5.If primer is to be ud, it should be applied within 4 hours after surface preparation.Plastics/Rubber:
1.Wipe with isopropyl alcohol.*
2.Abrade using fine grit abrasives.
3.Wipe with isopropyl alcohol.*
Glass:
1.Solvent wipe surface using acetone or MEK.*
2.Apply a thin coating (0.0001 in. or less) of 3M™Scotch-Weld™Metal Primer EC3901 or equivalent to the glass surfaces to be bonded and allow the primer to dry before bonding.
*Note: When using solvents, extinguish all ignition sources, including pilot lights, and
follow manufacturer’s precautions and directions for u.
Application Equipment Suggestions For smaller or intermittent applications, the 3M™EPX™Applicator is a convenient method of application.
For larger applications the products may be applied by u of flow equipment.Two part meter/mixing/proportioning/dispensing equipment is available for
intermittent or production line u. The systems may be desirable becau of their variable shot size and flow rate characteristics and are adaptable to many applications.
