Wrinkled flex Corner damage
Unsupported hole haloing
Finger prints/smudge on copper foil 铜面手指印/污渍线路弯曲板角缺损
非支撑孔白斑 Measle(Cross-ction)Resin starvation
Delamination Laminate voids
Laminate voids(Possible measle)Crazing
非支撑孔白斑/轻微的机械损坏非支撑孔白斑/严重的机械损坏板边白斑
板边白斑与非金属批锋 Measle over inner layer conductor Measled board(Board edge view)Unsupported hole haloing/slight mechanical damage Unsupported hole haloing/vere mechanical damage Haloing along edge
Haloing and nonmetallic burrs along edge 内层导体上面的白点 白点板(板边视图)白点(切片)
树脂不足 分层，爆板 碾压空洞
碾压空洞(可能是白点)白边
在散热区里的碾压空洞在散热区里的碾压空洞/白点碾压空洞与退胶Lamimate voids/measle in thermal zone Lamimate void in thermal zone Laminate void and resin recession 铜箔划伤和凹痕有电镀节点的导体线宽减小/粗糙边缘定义
被蚀刻掉的导体 织纹显露表面起泡/分层毗邻焊接块的起泡空洞
导线悬起导线削减后断线蚀刻不完全
被蚀刻掉的导体 (焊接块)/空里电镀空洞)导体针孔导体里的针孔粗糙边缘定义导线电镀铅悬起划伤的露铜导线
短路，外来铜丝剥离的导线
划伤的导线与基材面
划伤的内层导线与基材面 Copper foil-scratch and dent Conductor with plating nodules
Conductor width reduction/Rough edge definition Etched conductor Weave texture /exposure Surface blistering/delamination Blistering adjacent to land Voids
Conductor overhang
Conductor undercutting collap Incomplete etching
Etched conductor(land)/plating void in the hole Conductor-pin hole Pin hole in conductor
Conductor-rough edge definition Tin/lead plating overhang Scratched conductors exposing copper
Shorts,extraneous copper Peeled conductors
Scratched conductors and substrate Scratched inner conductors and substrate
Finger prints/smudge on copper foil 铜面手指印/污渍金手指/差劲的电镀粘合力悬起的焊接块
悬起的焊接块和板角裂痕 严重悬起的焊接块，板角裂痕 ，内层分离电金粘合力差镀通孔-焊接填充
孔的不可润湿性 差劲的焊接填充-空洞和去湿性金手指/凹痕，针孔和表面节结在金手指上的电镀凿痕
在金手指上的电镀划伤 金手指电镀异物 有露铜的导线表面不能润湿大面积的去湿
有去湿，不能润湿和焊接桥接的导线
孔完全填充-上表面不可润湿熔化后的电镀锡/铅喷锡(热风平整)焊接去湿
在盲孔里的表面拍偏拍偏 -崩孔内部铜箔裂缝/镀层裂缝(桶状的)
拍偏 -没有锡圈内层拍偏
焊接去湿与不能润湿表面焊接块锡铅污染
拍偏 良好的对准度电镀分离
表面污染/在铜箔里的非电镀分离Lifted land
Lifted land and corner crack
Gold contacts/Poor plating adhesion
Gold contacts/Pit,pin holes and surface nodules Plating on printed contacts gouged Plating on printed contacts scratched Severe lifted land, corner crack, innerlayer paration Separation between platings
Surface contamination/electroless paration from foil Poor solder fill- voids and dewetting Complete hole fill-nonwetting top surface Tin/lead plating after fusing Hor Air Solder Leveled(HASL)Gold contacts Plating anomalies Gold plating adhesion failure Plated-through hole-solder filled Nonwetting of hole
Good registration
短发发型男Misregistration -no annular ring Solder dewetting and nonwetting surface lands Tin lead contamination Misregistration Solder dewetting
Conductor surface nonwetting with epod copper Dewetting of large plane
Conductor with dewetting,nonwetting and solder bridging Copper plating- paration in plated-through hole Innerlayer paration and rein recession 内层分离和退胶Poor plating adhesion to hole wall
孔壁电镀粘合力差
Internal foil crack/Plating cracks(barrel)外部铜箔裂缝和板角裂缝 胶渍(水平视图)内层分离
电镀铜-在镀通孔里的分离有焊接去湿与不能润湿/附加蚀刻铜线的导线Internal foil crack
内部铜箔裂缝
Conductor with solder dewetting and nonwetting/plus etched conductors
External foil crack and corner crack Resin smear(Horizontal view)Surface misregistration in blind via Misregistration- hole breakout Innerlayer paration数码相机排行榜
Innerlayer misregistration
Finger prints/smudge on copper foil
铜面手指印/污渍
Voids in hole 孔里的空洞Nail heading
钉头
Plating void 电镀空洞 Protruding glass fibers, wicking and plating fold 玻璃纤维，毛细和镀层重叠突起Thin area in copper plating 在铜镀层里的薄区Plating fold, metal core board
镀层重叠，金属芯板
阿胶制作方法
Plating void/Barrel crack 电镀空洞/桶状裂缝Gross plating voids 总电镀空洞
Plating nodule
电镀节结
Separation along vertical edge of external foil 沿着外部铜箔竖直边缘的分离Negative etchback
负蚀 Negative etchback with plating fold and occlusion 有电镀重叠和闭塞的负蚀Electroless copper 非电镀铜 Etchback(positive)正蚀 Blow hole resulting from plating void 因电镀空洞而吹孔Barrel crack 桶状裂缝
Plating fold/Plating nodule 电镀重叠/电镀结节Taper plating
锥形电镀 Flxe plating voids, vere damage of flex substrate/Gross dielectric damage 挠性封装底板的挠性电镀空洞，严重损坏/总的非传导性损坏Flex barrel crack 挠性桶状裂缝 Flex plating voids
挠性电镀空洞
Corner crack 角落裂缝Severe corner crack 严重的角落裂缝Plating crack 电镀裂缝Plating paration (extending beyond vertical edge of external foil)
电镀分离(沿着外部铜箔竖直边缘延伸)Plating fold,inclusion,and nodule 电镀重叠，夹杂物和结节Interplane paration圆柱体的面积公式
内层分离
Separation along edge of external foil(top arrow)/Interplane paration (lower arrow)
沿着外部铜箔边缘的分离(上面箭头)/内层分离(下面箭头)
Horizontal microction/Pink ring 水平切片/分红圈Horizontal microction/Plating anomaly 水平切片/ 电镀异物Plating anomaly
电镀异物Rough edges
粗糙边缘
Machining inconsistencies 机械矛盾 Slot (protruding fibers)狭槽(纤维突起)悬起的焊接块/内层分离/孔壁电镀粘合力差/沿着外部焊接块竖直边缘的分离
Lifted land/Innerlayer paration/Poor plating adhesion to hole wall/Seperation along vertical edge of external land
Finger prints/smudge on copper foil 铜面手指印/污渍Missing hole 少孔Nicked edge on printed contact 印刷手指上的边缘刻痕 Twist 曲 Burr(drilling)
冰雹英语批锋(钻孔)
Edge condition-burrs (routing )边缘情形-批锋(锣板)
Solder resist misregistration
绿油拍偏 Solder resist misregistration, surface mount 绿油拍偏，表面安装Bow and twist 板弯曲 Typical solder resist 典型的阻焊(绿油)
Incomplete via tenting 不完全via 孔封孔
Solder resist blisters
绿油起泡Solder resist blisters/delamination 绿油起泡/分层Soda strawing 碱处理粗糙 Good ink marking 良好的水印白字
天高地厚的意思
Flaking /peeling
压成片/剥离Skip coverage-solder resist bubbles 跳跃覆层-绿油起泡Waves/ripples/wrinkles 起波浪/起波纹/起皱Impression stamped (illegible)压印白字(字迹模糊的)Etched marking 蚀字Smeared marking 油印白字 Impression stamp marking 压印白字效果 Etched marking (missing )蚀字(缺损)Wrong layup,multilayer board 错误压板结构，多层板Innerlayer image reverd 内层图象颠倒Missing or discolored oxide 缺少或变色氧化Pink ring 粉红圈Delamination(thermal zone)
分层(散热区)
Internal laminate delamination in prepreg area 在PP 区的内部碾压分层Poor trimming 差劲的修整性 Typical rigid-flex 典型刚-挠结合板
Typical flex
典型挠性板Typical flex (with stiffener)典型挠性板(有硬物)
Strain relief
张力减小
Trimming burrs
修整性批锋
Rigid-flex anomalies(unsupported hole haloing, solder on gold,trimming burrs,etc)刚-挠异物(非支撑孔白斑，金上焊料，修整性批锋，等等.Corrosion
腐蚀
Foreign material in covercoat 在覆盖下的异物 Tape residue 磁性残留物
Finger prints/smudge on copper foil 铜面手指印/污渍
Metal core board with through-hole and blind vias有镀通孔和盲孔的金属芯板
Metal core through-hole通孔金属芯板
Void in backfill dielectric material of metal core board在金属芯板衬垫绝缘物质里的空洞 Blind vias盲孔
荣耀畅玩平板2
Burr on metal core在金属芯板上的批锋
夏朝皇帝列表
Typical flush circuit典型的嵌入式电路
Typical flush microction典型的嵌入式电切片
Uneven resin fill flush circuit嵌入式电路不均匀填胶 Foreign material -hair异物-发丝
Foreign material-stained异物-污物
Surface contamination表面污染
Gross multiple problems总的多重问题
