专利名称：CHIP PEELING METHOD, CHIP PEELING
版权页APPARATUS AND SEMICONDUCTOR DEVICE
3分钟自我介绍
MANUFACTURING METHOD
发明人：NAKATSU, Akira租房合同word免费下载
申请号：JP2008070056
申请日：20081104shift键
预备的意思
公开号：WO10/052758P1
公开日：
20100514
专利内容由知识产权出版社提供
摘要：Provided are a chip peeling method wherein cracks due to a stress applied upon sliding can be reduced and a chip to be peeled can be easily peeled and taken out, a chip peeling apparatus and a miconductor device manufacturing method. A stage (16) is arranged directly below an adhesive sheet (12) having a chip (11) adhered on the upper surface. The stage (16) is provided with a fixed stage ction (16b) and a movable stage (16a) which can freely tilt and slide. A part of the periphery of the chip (11) is protruded from the movable stage ction (16a). While having the chip protruding side of the movable stage ction (16a) brought into contact with the side of the fixed stage ction (16b), the chip protruding side of the movable stage ction (16a) is brought up, and a gap (19) is arranged below a protruding ction (31). In a tilting state, negative pressure is permitted to operate to the gap (19), while maintaining a aled state of the gap (19) by contact, then, the movable stage ction (16a) is slid in the horizontal direction to the side opposite to the chip protruding side.
雨打风吹去
申请人：NAKATSU, Akira
租房协议简单版>吴山烤鸡地址：JP,JP
国籍：JP,JP
代理机构：TANAKA, Hideyoshi 更多信息请下载全文后查看
