SiC 2010How SiC will impact electronics: A 10
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Dow corning
II-VI
AIST Mitsubishi Electric
Rohm Fraunhofer ISE
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三体感悟
Table of Content
•Glossary
•Executive summary
p6
•From Silicon to SiC. Total Accessible Market analysis p16•SiC industry outlook p28•Low-Voltage Application
p16
–Power Factor Corrector: PFC
牛津街•
Medium-Voltage Application
p43–Electric Vehicles / Hybrid Electric Vehicles: EV/HEV –Inverter for solar panels
worthy–Uninterrupted Power Supplies: UPS –
Industrial AC Motor Drives •High-Voltage Application
p127
–Rail Traction
–Smart Power Grid
–Ships & Vesls propulsion –
Wind Turbines
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SiC substrate market: n-type and S.I.
p171•SiC technology: devices and power modules p196•Appendix
p219
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SiC-bad device revenues and related
2008 company market shares
CREE $xxM
Osram
$xxM
Others are emerging merchant 2008 activities from:
-STMicroelectronics -SemiSouth -MicroSemi -Shindengen -Sanrex -Rohm -…
Source: Yole Développement
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P E
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100200300400500
600700
80090020082009
2010
20112012
2013
20142015
2016
2017
20182019建行大额存单20万起存
M a r k e t s i z e (M $)
10 years long-term market forecast for SiC devices in various power
applications
Others Ships & Vesls Smart Grid Power Rail traction
PV inverters Wind Turbine Motor AC Drive
UPS EV/HEV PFC
10-years projection of SiC power device market size split by
applications
Source: Yole Développement
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Main manufacturing steps of the SiC
device processing
Bulk SiC growth
Epitaxy
Wafering Polishing
SiC boule
Sublimaton HT-CVD LPE; VLS
SiC wafer
Front-End
SiC epi-wafer
dies-on-wafer
Back-End level 0
Back-grinding Dicing,Flip-chip Die shaping
Back-End level 1
徐州云龙湖Binning, pick-and-place Packaging, Housing
Packaged devices
Power module
Litho, deposition,
etching, metallization…
陈美里
Bare-die
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