Clean Cross Section Preparation Cross Section Polisher
Serving Advanced Technology
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Front cover image :
Top: Ceramic particles (refer to page 5), Bottom: Reaction layers of tin and copper (refer to page 6).
Innovative Tool Filled with Patented Un JEOL Application Specialists.The Cross Section Polisher (CP)
A cross ction at 90 degrees to the surface of a specimen (JEOL patent)
The cross ction polisher (CP), which is supported by the patented technology developed by JEOL, makes a cross ction perpendicular to the surface of a specimen. This is suitable for measurement of multi-layered structures.
Clean polished cross ction of almost any material in simple steps
The CP can prepare a perfect cross ction from almost any material such as;
b Difficult-to-polish soft materials such as copper, aluminum, gold, solder, and polymer, b Difficult-to-cut hard materials such as cerami
c an
d glass, and b Composit
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refer tof the materials.
The cross ction prepared by the CP is suitable for EDS, WDS, Auger, and EBSD (Electron Back Scatter Diffraction) analysis, and for obrvation and measurement of multi-layered structures.
Prervation of internal structures
The CP prerves structures, which the conventional mechanical polish would destroy, such as voids in a bonded interface between gold wire and bonding pad. Adhesion between plated lay-ers, or between solder and metal, can be obrved and analyzed accurately. The perfect cross ction is suitable for analysis of precipitates as well.
tora toCompared with FIB
英语 单词
Damage to a specimen during polishing is much less compared to FIB preparation due to the u of an argon ion beam. The CP can make a large cross ction surface with up to 1mm width.
No skill needed
Making a surface of soft materials by mechanical polish or a microtome requires many years of experience. The CP readily lets you make a perfect cross ction after minimal practice.
The maximum specimen size for the CP is 11mm(W)x10mm(D)x2mm (H). A cutter such as ISOMET is a handy tool to cut out a speci-men. Etching is done faster when a point of interest is clor to the edge of a specimen.Handy Lap made by JEOL is available to file out an excess portion from the edge.
1Cut out and trim a specimen:
Heat fixing epoxy is applied to the surface of a specimen, if the surface is not flat.
2Surface treatment
A specimen is fixed on the specimen holder with wax.
3Fixing a specimen on the specimen holder:
The voltage and current of ion beam, and etching time are t to the CP.
4Setting the etching condition after mounting the specimen in CP:
The ion beam hits perpendicular to the surface of a specimen and makes a cross ction per-pendic
ular to the surface of a specimen. The ion beam is parallel to a cross ction. The damage to a cross ction caud by the ion etching is much less compared to the conven-tional ion etching method in which the ion beam hits the surface of etched surface.
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mmkEtching:
Preparation of a cross ction -Simple procedure-
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Handy Lap (Polisher) : option
ISOMET (Cutter) : option
Rotation specimen holder (option)
Shielding plate Specimen
Ion beam
Cross ction
Rotation specimen holder
The rotation specimen holder is devel-oped for preparation of a better cross ction with fine powder, wire, or a com-posite of hard and soft materials. The small amount of specimen is mounted on the center of a rotation specimen holder with epoxy. The holder is then mounted on the rotation stage. The rota-tion specimen holder can also be ud for finishing polish of a flat surface by bombarding the ion beam at a very low angle to the surface.
nique Technology Developed by
Magically Powerful Tool
-- Jobs difficult with the conventional methods are done efficiently--
Application to SEMspawn
Paper
4The cross ction prepared with the
CP shows very little damage as shown
in this example (right).
Si(EDS)Ca(EDS)
Cross ction by the CP
(Backscattered electron image)
Application to SEM
emily bearGranular medicines
This is a cross ction of medical
material. It has been extremely difficult
to prepare a good cross ction since
it is nsitive to heat. In this prepara-
tion, the distributions of two materials
are clearly obrved.
C(EDS)
Na (EDS)O(EDS)
Backscattered electron image
The CP assists SEM, EPMA, and Auger in improving the quality and accuracy of analysis.
The cross ction prepared with a razor edge often shows artifacts such as a loss of inorganic particles (shown in circle), or fibers being compresd.
C(EDS) 300Ȑm
数学笑话
10Ȑm
10Ȑm
Application to SEM
Gold wire bonding
Application to SEM
Application to SEM
Super conductive wire
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The CP can cut hard materials such as ceramic. The optional rotation specimen holder makes a smooth cross ction of powder held with heat tting epoxy.
This is a cross ction of super conductive wire. The difference between the peripheral and the central regions is clearly obrved. The rotation specimen holder makes a smooth cross ction of wire.
Ceramic particles
The CP can prepare a cross ction of soft materials such as gold with little damage. The CP is suita
ble for evaluation of voids in the boundary of bonded metals. The conventional mechanical polishing is known for difficulties such as the fine voids being smeared, pol-ish grains being embedded in soft materials, paration of bonded materials, and residual polishing marks being left. The CP can solve the technical difficulties.苹果广告主题曲
Backscattered electron image
Backscattered electron image
Surface (Secondary electron image)
Cross ction (Backscattered electron image)
Cross ction (Backscattered electron image)
Backscattered electron image
Backscattered electron image
10Ȑm
成都朗阁培训中心1Ȑm
100Ȑm
100Ȑm
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100Ȑm
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