专利名称：THERMAL MODULE
发明人：Hsiu-Wei Yang
crossroad
申请号：US13869971
申请日：20130425
公开号：US20140318744A1
三年级下册英语人教版电子课本公开日：
sortof
singles day20141030
专利内容由知识产权出版社提供
mdrt专利附图：沃尔得英语
摘要：A thermal module includes a first heat transfer member and a cond heat transfer member. The first heat transfer member has a first chamber in which a first我是歌手第三季冠军
capillary structure is dispod. The cond heat transfer member has a cond chamber and a conduction ction. A cond capillary structure is dispod in the cond chamber.
give me five什么意思The conduction ction is received in the first chamber. A third capillary structure is dispod on outer surface of the conduction ction. A working fluid is respectively filled in the first and cond chambers. The third capillary structure is dispod on the outer surface of the conduction ction to enhance the heat transfer effect of the cond heat transfer member so as to enhance the heat transfer efficiency of the entire thermal module.amalie
申请人：ASIA VITAL COMPONENTS CO., LTD.
地址：New Taipei City TW
ldom国籍：TW
更多信息请下载全文后查看
