中学英语
专利名称：PACKAGE STRUCTURE
发明人：Kuo-Yang Sun,Chia-Ming Yang
申请号：US10711794success的动词
申请日：20041006
公开号：US20060001134A1
公开日：权威留学中介
proper是什么意思
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专利内容由知识产权出版社提供
专利附图：
摘要：A package structure includes a lead frame having a plurality of leads, each of which includes a first recession, at least a first device, and a plurality of solder joints
nicholas送礼给领导respectively positioned in the first recessions for connecting the first device to the lead frame.
申请人：Kuo-Yang Sun,Chia-Ming Yang
地址：11F, No. 430, Lida Rd., Zuoying District Kao-Hsiung City TW,No. 193-8, Yuxiao Rd., Guansheng Li, East District Tai-Nan City TWchallenging
国籍：TW,TW
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