SDRAM Product Guide
November 2007
Memory Division
A. SDRAM Component Ordering Information
16 : 16Mb, 4K/64ms 64 : 64Mb, 4K/64ms 28 : 128Mb, 4K/64ms 56 : 256Mb, 8K/64ms 51 : 512Mb, 8K/64ms 04 : x 4
06 : x 4 Stack (Flex frame) 07 : x 8 Stack (Flex frame)08 : x 8
16 : x16 32 : x322 : LVTTL (3.3V, 3.3V)
2 : 2 Banks
3 :
4 Banks
3. Product
4. Density & Refresh
5. Organization
6. Bank
7. Interface ( V DD , V DDQ )
756050M A B C D E F H
9. Package Type
8. Revision
11. Speed (Default CL= 3)
1. SAMSUNG Memory : K
2. DRAM : 4
Revision
Bank
Organization
Density & Refresh Product
DRAM SAMSUNG Memory Interface (V DD , V DDQ )英语六级网上报名
Package Type
Temperature & Power
K 4 S X X X X X X X - X X X X
1 2 3 4 5 6 7 8 9 10 11
Speed
S : SDRAM : 7.5ns, PC133 (133MHz CL=3): 6.0ns (166MHz CL=3): 5.0ns (200MHz CL=3)
: 1st Gen.: 2nd Gen.: 3rd Gen.: 4th Gen.: 5th Gen.: 6th Gen.: 7th Gen : 9th Gen
10. Temperature & Power
T N L : TSOP II
: sTSOP II
: TSOP II U V : TSOP II (Lead-free)*1: sTSOP II (Lead-free)*1J K N : 11th Gen.: 12th Gen : 14th Gen
(Lead-free & Halogen-free)*1
C L I P : Commercial Temp.( 0°C ~ 70°C) & Normal Power : Commercial Temp.( 0°C ~ 70°C) & Low Power : Industrial Temp.( -40°C ~ 85°C) & Normal Power : Industrial Temp.( -40°C ~ 85°C) & Low Power
Note 1: All of Lead-free or Halogen-free product are in
compliance with RoHS
B. SDRAM Component Product Guide
Density
Bank
Part Number Package *1 & Power *2 &
Speed *3Org.Interface
Refresh
Power (V)
Package
Avail.
64Mb K-die
4Banks
K4S640832K
UC75UL75
8M x 8
LVTTL
4K/64ms
3.3 ± 0.3V
Lead-free 54pin TSOP(II)
EOL DEC. ’08
K4S641632K UC50/C60/C75UL50/L60/L75 4M x 1664Mb N-die
4Banks
K4S640832N
LC75LL75
8M x 8
LVTTL
4K/64ms
3.3 ± 0.3V
Lead-free & Halogen-free
54pin TSOP(II)
4Q’07CS
K4S641632N LC50/C60/C75LL50/L60/L75 4M x 16128Mb I-die
4Banks
K4S280432I
UC75UL7532M x 4LVTTL
4K/64ms
3.3 ± 0.3V
Lead-free 54pin TSOP(II)
EOL AUG. ’08
K4S280832I UC75UL7516M x 8K4S281632I UC60/C75UL60/L758M x 16128Mb K-die
4Banks
K4S280432K
U *4C75UL7532M x 4LVTTL
4K/64ms
3.3 ± 0.3V
Lead-free & Halogen-free
54pin TSOP(II)*4
Now
affirmationK4S280832K UC75UL7516M x 8K4S281632K UC60/C75UL60/L758M x 16256Mb H-die
4Banks
K4S560432H
UC75UL7564M x 4LVTTL
8K/64ms
3.3 ± 0.3V
Lead-free 54pin TSOP(II)
EOL SEP . ’08
K4S560832H UC75UL7532M x 8K4S561632H UC60/C75UL60/L7516M x 16256Mb J-die
4Banks
K4S560432J
U *4C75UL7564M x 4LVTTL
8K/64ms
3.3 ± 0.3V
Lead-free & Halogen-free
54pin TSOP(II)*4
Now
K4S560832J UC75UL7532M x 8K4S561632J UC60/C75UL60/L7516M x 16512Mb D-die
4Banks
K4S510432D
UC75UL75128M x 4LVTTL
8K/64ms
3.3 ± 0.3V
Lead-free 54pin TSOP(II)Now
K4S510832D UC75UL7564M x 8K4S511632D
UC75UL75
32M x 16
Note 2 :
Temperature and Power
Description
C Temperature, Normal Power L
Temperature, Low Power
Note 1 :
U : TSOP(II) (Lead-free)
L : TSOP(II) (Lead-free & Halogen-free)Note 3 :
* All products have backward compatibility with PC100.
Speed Description
757.5ns, PC133 (133Mhz @ CL=3)
60 6.0 ns (166Mhz @ CL=3)50
5.0 ns (200Mhz @ CL=3)
- Commercial Temp (0°C < Ta < 70°C)
Note 4 : 128Mb K-die SDR and 256Mb J-die SDR DRAMs support Lead-free & Halogen-free package with Lead-free package code(-U)
C. Industrial Temperature SDRAM Component Product Guide
Density Bank Part Number Package *1 & Power *2
& Speed *3Org.Interface Refresh Power (V)Package
Avail.64Mb K-die 4Banks
KS641632K UI60/I75UP60/P754M x 16LVTTL 4K/64ms 3.3 ± 0.3V Lead-free 54pin TSOP(II)EOL DEC.’0864Mb N-die 4Banks KS641632N LI60/I75LP60/P754M x 16LVTTL 4K/64ms 3.3 ± 0.3V Lead-free & Halogen-free
54pin TSOP(II)1Q’08128Mb I-die 4Banks K4S281632I UI60/I75UP60/P758M x 16LVTTL 4K/64ms 3.3 ± 0.3V Lead-free 54pin TSOP(II)EOL AUG.’08128Mb K-die 4Banks K4S281632K U *4I60/I75UP60/P758M x 16LVTTL 4K/64ms 3.3 ± 0.3V Lead-free & Halogen-free
54pin TSOP(II)*4Now 256Mb H-die 4Banks K4S561632H UI60/I75UP60/P7516M x 16LVTTL 8K/64ms 3.3 ± 0.3V Lead-free 54pin TSOP(II)EOL SEP .’08256Mb J-die
4Banks
K4S561632J
U *4I60/I75UP60/P75
16M x 16
LVTTL
8K/64ms
3.3 ± 0.3V
Lead-free & Halogen-free
54pin TSOP(II)*4
Now
billabongNote 2 :
- Industrial Temp (-40°C < Ta < 85°C)
whosays
Temperature and Power
Description
I Industrial Temperature, Normal Power P
Industrial Temperature, Low Power
Note 1 :
U : TSOP(II) (Lead-free)
L : TSOP(II) (Lead-free & Halogen-free)Note 3 :
Speed Description
757.5ns, PC133 (133Mhz @ CL=3)
60 6.0 ns (166Mhz @ CL=3)50
5.0 ns (200Mhz @ CL=3)
Note 4 : 128Mb K-die SDR and 256Mb J-die SDR DRAMs support Lead-free & Halogen-free package with Lead-free package code(-U)
3 : DIMM
4 : SODIMM 63 : x63 PC100 / PC133 µSODIMM with SPD for 144pin
64 : x64 PC100 / PC133 SODIMM with SPD for 144pin (Intel/JEDEC)66 : x64 Unbuffered DIMM
with SPD for 144pin/168pin (Intel/JEDEC)74 : x72 /ECC Unbuffered DIMM
with SPD for 168pin (Intel/JEDEC)77 : x72 /ECC PLL + Register DIMM with SPD for 168pin (Intel PC100)90 : x72 /ECC PLL + Register DIMM
with SPD for 168pin (JEDEC PC133)Commercial Normal Commercial Low
T TSOP(II) (400mil)N sTSOP(II) (400mil) U TSOP(II) Lead-free (400mil) V sTSOP(II) Lead-free (400mil) 16 : 16M 32 : 32M 64 : 64M 28 : 128M 56 : 256M
M 1st Gen. A 2nd Gen. B 3rd Gen. C 4th Gen. D 5th Gen. E 6th Gen.
F 7th Gen. H 9h Gen.
J 11h Gen.
0 Mother PCB 2 2nd Rev. U Low Profile DIMM S : SDRAM 1. Memory Module : M 2. DIMM Configuration
3. Data Bits
4. Feature
5. Depth
12. Speed (Default CL= 3 )
11. Power
10. PCB Revision & Type
9. Package
8. Component Revision
Composition Component
PCB revision & Type
Component Revision Refresh, # of Banks in Comp. & Interface
Depth
Feature Data bits DIMM Configuration Memory Module Package
Power
Speed 0 : x 43 : x 84 : x16
8 : x 4 Stack (Flexframe)9 : x 8 Stack (Flexframe)瑜伽培训
M X X X S X X X X X X X - X X X
7. Composition Component
1 2 3 4 5 6 7 8 9 10 11 12
2 : 4K/ 64ms Ref., 4Banks & LVTTL 5 : 8K/ 64ms Ref., 4Banks & LVTTL
6. Refresh, # of Banks in comp. & Interface
D. SDRAM Module Ordering Information
: : : : : : : : : : : : : :C L : : : : 1 : 1st Rev. 3 : 3rd Rev. S : 4Layer PCB.
( 0°C ~ 70°C)( 0°C ~ 70°C)
7A : PC133 (133MHz CL=3/PC100 CL2)
09 : 8M (for 128Mb/512Mb)17 : 16M (for 128Mb/512Mb)33 : 32M (for 128Mb/512Mb)65 : 64M (for 128Mb/512Mb)29 : 128M (for 128Mb/512Mb)59 : 256M (for 128Mb/512Mb)
E. SDRAM Module Product Guide
Org.
Density
Part No.
Speed
Compositionpermission denied
Comp. Version
Power (V)
Internal Banks
External Banks
free tube8
Feature Avail.
168pin PC133 Registered DIMM
32Mx72256MB M390S3253HU1C7A 32M x 8 * 9 pcs 256Mb H-die 3.3 V
4
1DS, 1500mil EOL JUN.’08
64Mx72
512MB
M390S6450HU1C7A 64M x 4 * 18 pcs 256Mb H-die 1DS, 1700mil M390S6450HUU
C7A
64M x 4 * 18 pcs
256Mb
H-die
1
DS, 1200mil
168pin PC133 Unbuffered DIMM
8Mx64
64MB
M366S0924IUS C7A 8M x 16 * 4 pcs 128Mb I-die 3.3V
4
1SS, 1000mil EOL JUN.’0816Mx64
128MB李佳明简历
M366S1723IUS
C7A 16M x 8 * 8 pcs 128Mb I-die 1SS, 1375mil M366S1654HUS C7A 16M x 16 * 4 pcs 256Mb H-die 1SS, 1000mil EOL JUN.’08M366S1654JUS
C7A 16M x 16 * 4 pcs 256Mb J-die 1SS, 1000mil Now
16Mx72M374S1723IUS C7A 16M x 8 * 9 pcs 128Mb I-die 1SS, 1375mil EOL JUN.’0832Mx64256MB
M366S3323IUS C7A 16M x 8 * 16 pcs 128Mb I-die 2DS, 1375mil 32Mx72M374S3323IUS C7A 16M x 8 * 18 pcs 128Mb I-die 2DS, 1375mil 32Mx64M366S3253JUS C7A 32M x 8 * 8 pcs 256Mb J-die 1SS, 1375mil Now 64Mx64
512MB M366S6453HUS C7A 32M x 8 * 16 pcs 256Mb H-die 2DS, 1375mil EOL JUN.’08M366S6453JUS
C7A
32M x 8 * 16 pcs
256Mb
J-die
2
DS, 1375mil
Now 144pin PC133 SODIMM
16Mx64
128MB
globaltimesM464S1724IUS L7A 8M x 16 * 8 pcs 128Mb I-die 3.3V
4woolen
1DS, 1250mil EOL JUN.’08M464S1724KUS
L7A 8M x 16 * 8 pcs 128Mb K-die 1DS, 1250mil Now 32Mx64
256MB
M464S3254HUS L7A 16M x 16 * 8 pcs 256Mb H-die 1DS, 1250mil EOL JUN.’08M464S3254JUS
L7A 16M x 16 * 8 pcs 256Mb J-die 1DS, 1250mil Now 64Mx64
512MB
M464S6453HV0 L7A 32M x 8 * 16 pcs 256Mb H-die 2DS, 1250mil EOL JUN.’08M464S6453JV0
L7A
32M x 8 * 16 pcs
256Mb
J-die
2
DS, 1250mil
Now
