Over-Coating
Copper foil minimum thickness of PCB: 3oz Resistance
A B C L
小学二年级教学计划
0.0005-0.005 2.3 1.0 0.8 0.7
不言而喻翻译Type Packing W P E F P2 D D1 P010P0A0B0K0t新东方在线网络课堂
ground
RLF06 Emboss 8.00 4.00 1.75 3.50 2.00 1.50 1.00 4.00 40.00 1.77 3.40 1.04 0.22
+0.10
Series ψA ψB ψC W Tarau
if从句
RLF06 178±2.0 60.0±1.0 13.0±1.0 9.0±1.0 11.5±1.0
Unit: mm 11. Peeling Strength of Top Cover Tape
英汉互译在线
Peak : 260
5
5
knock-+℃ , 10±1 c Pre – heat Zone : 150 to 180 ℃, 90±30 c Soldering Zone : 230℃ or higher , 30±10 c
reactorIron Solder:350±10℃ , 3+1/-0 c
15. ECN
Engineering Change Notice: The customer will be informed with ECN if there is significant modification on the characteristics and materials described in Approval Sheet.george zimmerman
