教师节祝福语英语版专利名称：Method and apparatus for the
electrochemical deposition and
planarization of a material on a workpiece
surface
发明人：Ismail Emesh,Periya Gopalan,Phillip M.
Rayer,Bentley J. Palmer
申请号：US10921666
太原会计培训学校申请日：20040818
公开号：US20050016681A1
motion是什么意思>bradford
公开日：政治面貌英文>河北学位英语考试
克林顿演讲
20050127
专利内容由知识产权出版社提供
专利附图：loface
摘要：An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus compris a polishing pad and a platen which is in turn comprid of a first conductive layer in contact with the polishing pad and coupled to a first potential, a cond conductive layer coupled to a cond potential, and a first insulating layer dispod between the first and cond conductive layers. At least one electrical contact is positioned within the polishing pad and is electrically coupled to the cond conductive layer. A rervoir is provided which places an electrolyte solution in contact with the polishing pad and the workpiece. A carrier positions and/or press the workpiece against the polishing pad.
申请人：Ismail Emesh,Periya Gopalan,Phillip M. Rayer,Bentley J. Palmer
批评>remilia地址：Gilbert AZ US,Chandler AZ US,Chandler AZ US,Chandler AZ US
国籍：US,US,US,US
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