专利名称：POLISHING DEVICE FOR REMOVING
auctioneerPOLISHING BYPRODUCTS
发明人：FENG CHEN,MINGQI LI
申请号：US14327363
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哈尔滨环球雅思国际英语学校申请日：20140709
提出翻译公开号：US20140323018A1
street view公开日：
20141030nice lady
专利内容由知识产权出版社提供
专利附图：
摘要：A method for removing polishing byproducts and a polishing device are
童趣的翻译
provided. The method includes mounting a positive electrode on the center of a
polishing platen and a negative electrode on an edge of the polishing platen, applying acup是什么意思
voltage between the positive electrode and the negative electrode after a polishing process for metal is finished, and rotating the polishing platen and rinsing a polishing pad with deionized water or a chemical cleaning solution to remove polishing byproducts that are formed in the polishing process. The combination of the centrifugal force and the electromotive force increas the removal rate of the polishing byproducts.
申请人：Semiconductor Manufacturing International (Shanghai) Corporation
地址：Shanghai CN
国籍：CN
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