专利名称：Drum-side treated metal foil and laminate for u in printed circuit boards and
methods of manufacture
发明人：D. ERIC SEIP
申请号：AU6941394十二月英文
united arab emiratesuntether申请日：19940302
公开号：AU6941394A
公开日：
kenda
universal robot19940926
专利内容由知识产权出版社提供
摘要：Drum or smooth side-treated metal foil can be ud either as an intermediate product for u in the manufacture of laminate or as a part of the finished laminate to be ud in the manufacture of multi-layer printed circuit boards (PCB) packages. By treating the drum or smooth side of metal foil with a bond strength enhancer rather than treating the matte side or rough side, or both sides, veral time-consuming and costly steps can be bypasd in the manufacture of multi-layer printed circuit boards (PCB) while the integrity of the metal foil, laminate and multi-layer PCB are not compromid and are actually enhanced by way of improved impedance control and adhesion characteristics after relamination. This novel foil can be initially bonded to substrate on either side before circuit formation and can be ud either as an integral foil layer or as a foil cap. The invention includes methods of manufacture of the metal foil, laminate and multi-layer printed circuit board. A variation of the invention involves a component or tool for u in manufacturing articles such as printed circuit boards. The component is a temporary laminate constructed of one or more sheets of drum-side-treated copper foil mounted on a sheet of aluminum. The copper foil, which, in a finished printed circuit黄油手
board, will constitute a functional element, has a drum-side, which has been subjected to an adhesion-promoting treatment, and a rough side, which has not been suject to the adhesion-promoting treatment. The sheet of aluminum constitutes a discardable or reusable element. Either surface (treated drum-side or untreated matte side) of each copper sheet can be bonded to the aluminum, depending on which embodiment of the basic invention is being ud. The side of the copper foil not bonded to the aluminum will be bonded to the resin in the next step.differentwith
申请人：POLYCLAD LAMINATES, INC.
winnie the pooh
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