JESD22-A101D

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JEDEC
STANDARD
Steady-State Temperature-Humidity Bias Life Test
JESD22-A101D
淡泊的意思(Revision of JESD22-A101C, March 2009)
JULY 2015trunking
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
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JEDEC Standard No. 22-A101D
Page 1
Test Method A101D
(Revision of Test Method A101C) TEST METHOD A101D
STEADY-STATE TEMPERATURE-HUMIDITY BIAS LIFE TEST
(From JEDEC Board Ballots JCB-96-64, JCB-09-10, and JCB-15-28, formulated under the cognizance of JC-14.1 Committee on Reliability Test Methods for Packaged Devices.)
1 Scope
The Steady-State Temperature-Humidity Bias Life Test is performed to evaluate the reliability of non-hermetic packaged IC devices in humid environments. Temperature, humidity, and bias conditions are applied to accelerate the penetration of moisture through the external protective material (encapsulant or al) or along the interface between the external protective material and the metallic conductors which pass through it.
2 Apparatus
The test requires a temperature-humidity test chamber capable of maintaining a specified temperature and relative humidity continuously, while providing electrical connections to the devices under test in a specified biasing configuration.
2.1 Temperature and relative humidity
The chamber must be capable of providing controlled conditions of temperature and relative humidit
y during ramp-up to, and ramp-down from, the specified test conditions.
NOTE Care should be taken to ensure the test chamber (dry-bulb) temperature exceeds the wet-bulb temperature at all times.
2.2
Devices under stress
Devices under stress must be physically located to minimize temperature gradients.
NOTE  Care should be taken to minimize relative humidity gradients and maximize air flow between devices.
2.3
Minimize relea of contamination
Care must be exercid in the choice of board and socket materials to minimize relea of contamination, and to minimize degradation due to corrosion and other mechanisms.
2.4 Ionic contamination
Ionic contamination from the test apparatus (e.g., card cage, test boards, sockets, wiring, storage containers, etc.) shall be controlled to avoid test artifacts.
2.5 Deionized water
Deionized water with a minimum resistivity of 1 M Ω-cm at room temperature shall be ud.

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