PRODUCT AUDIT CHECKLIST
Score Score[Document number listed]
5. SMT PRINTING
A. Solder Paste
5.1Is the Solder paste part number correct with Work Instruction ?1
5.2Is the solder past valid usage within date before expire ?1
5.3Does the solder paste stir corrected against Work Instruction ?1
1
5.5Does the solder thickness met requirement and is the thickness measured on each interval time
commit controlled ?
1
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5.6Can explain if the paste printing CPK Data out of specification, what the action taken to eliminated
problem ?
5.7Is the machine identified on the Work Instruction and record quality ?1
B. Placement + Wave
5.8Are the components/ part addresd correctly on the loader against BOM or Loading component?1
1
5.9Does the failure pick and place component flag/ alarm and execution stop when abnormal condition六月英语
detected ?
5.10Does the program executing appropriated to the product audit ?1
5.11Does the component feeder correct with the requirement ?1
1
5.12Does the PWB part number cross-reference to the PCBA part number and revision on BOM/Loading
component? (probably part number affix on packaging]
1
5.13Does the Wave solder temperature, conveyor speed determined on the Loading component or
Work Instruction ?
1
5.14Does the S/N label attached properly refer to Work Instruction, location, alignment, legible, no
wrinkle or smeared ?
5.15Is it the qualification maintain? Review record pertaining qualification1
C. AOI Inspection
杭州西溪印象城5.16Is the revision and controlled document provided and followed ?1
5.17Are AOI complementary methods, which include solder joint inspection, ud for all reflowed parts ?1
5.18Is the AOI programmed update with customer feedback or failure ICT/FCT ?1
5.19Does the rejected board put sticker and keep parately with pasd board ?1
5.20Does the AOI program cover the critical component, solder joint and other specify from customer ?1
5.21Is the Pasd board stamp in a uniquely location to identify after AOI pasd ?1
D. Manual Inspection
5.22Is the revision and controlled document provided and followed ?1
1
5.23Is the equipment (microscope, luxo lamp, stamp, acetone, ethanol, etc) mentioned and required at
pads
Work Instruction ?
5.24Does the Rejected park identify and parated with pasd board?1
5.25Does the Critical component inspection addresd on the Work Instruction and followed ?1
5.26Is it record maintain ? Review the record pertaining quality product audit.1
6. AUTO INSERT
6.1Is the revision controlled Work Instruction displayed for operator to executed ?1
6.2Does the part appropriate with the product specification BOM/ Loading list ?1
6.3Is the Lead length; lead angle; polarity and value met the requirement ?
1
The minimum sampling taken for verification
7. COMPONENT PREPARATION & MANUAL INSERT
7.1Is the revision controlled Work Instruction displayed for operator to executed ?1
7.2Does the cutted component met the specification and tolerance requirement ?
1
(Check the minimum sampling to verify cut/ forming specification)
7.3Does the equipment/tools details and assigned as per Work Instruction?1
1
7.4Does the Machine cutting specify and standard usage for the model audit ?
(The Work Instruction may requested clarifies machine)
8. MANUAL SOLDER & TOUCH UP
A. Board Cut Tab
8.1Is the revision controlled/updated Work Instruction displayed for operator to executed ?1tothebeginning
8.2Does the result cutted good ? evidence verified if met the requirement !1
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8.3Are the controlled/updated Work Instruction displayed for the operator at each assy. station ?1
8.4Is the solder Work Instructionre corrected and mentioned on the Work Instruction ?1
8.5Is the component orientation and location inrted correct ?1
1
8.6Does the Poka Yoke maintain as the one piece inrt in one hand?
The lots grasp components is not allowed
1
8.7Does the soldering result appearance met the standard requirement per IPC-610D ?
Inspect the minimum sampling for verification solder appearance.
8.8Does the supported jig/template are valid with product ? NA for jig/template not requirement and
1
Score '0' for improper jig or template
1
8.9Does the label attached referred to Work Instruction, alignment, location ? (Take sample to verify
label attached)
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8.10Is the cleaning method appropriate with the requirement on Work Instruction ?
1
The cleaner acetone, kester, ethanol shall determined on the Work intruction.
1
8.11Can demonstrate how to conduct the proper cleaning method, monitoring the operator when board
cleaning ? Score NA if the point 8.9 not required.
8.12Does the Rejected board identified, sticker/arrow and put parately in convention ?1
1
8.13Does the board pasd wrap or handle with the properly package ?
(Bubble bag, anti static bag, etc.)
8.14Can demonstrate if the AOI inspected the critical component ?1
8.15Is the AOI re-programmable for ICT failure or customer complain ?1
8.16Does the AOI board pass indicate with unique stamp/code location ?
1
Neither rejected board does the sticker put on reject location ?
Score Score[Document number listed] 9. ICT
9.1Is the controlled Work Instruction displayed for the operator at testing station ?1
1
9.3Does the first board run already qualified by good sample or master sample ?
Record list may require as evidence
9.4Does the boards put parately 'before and after' tested according to convention ?1
1
9.5Does the rejected board put on the parately bin/tray with reject name/loc/or
test printed result ?
1
9.6Does the programmed update with the latest version of program or checksum? (Review the
company的用法evidence on monitor)
1
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9.7Does the Pasd board stamp with specify marking color to indicated if the board
has ICT pasd ?
9.8Does the tested result (Good or Rejected) recorded to FPY performance ?1
10. REWORK & REPAIR
10.1Is the controlled/updated Work Instruction displayed for the operator at Rework Station ?1
1
10.2Is the capability of each piece of rework equipment defined to ensure the correct equipment is ud
for the correct rework operation ?
10.3Is the rework process and equipment ud appropriate to met established industry standards ?1
1
10.4Is there a tracking system in place to monitor and limit the number of Reworks conducted on any
given unique board rial number ?
10.5Is the component reworked, replace conducted on the properly station and standard
1
tools/equipments (i.e. IC's,BGA's, Connectors,etc) ?
1
10.6Is there chemical liquid u as Work Acetone, Ethanol or IPA ? If yes is it control and
clear label identification ?
10.7Is the Equipment solder tip, temperature, time dwell notice on the Work Instruction ? Over heat and
1
time may cau the solder oxidation
10.8Does the boards after rework/repair returning to visual or AOI inspection with tag information traveler1
1
10.9Does the Rework board been recorded and make the analysis report for traceability and further
investigation for improvement ?
11. FCT
11.1Is the controlled Work Instruction displayed for the operator at testing station ?1
11.2Does the first board run already qualified by good sample or master sample ? Record list may
1
require as evidence.
11.3Does the boards put parately 'before and after' tested according to convention ?1
11.4Does the rejected board put on the parately bin/tray with reject name/loc/or test printed result ?
1
Score '0' for unidentify unit rejected.
11.5Does the programmed update with the latest version of program or checksum? (Review the
1
evidence on monitor) demonstrate if the programmed is appropriate with the latest product
11.6Does the Pasd board stamp with specify marking color to indicated if the board has ICT pasd ?1
11.7Does the testing result recorded in purpo for FPY performance ?1
12. FINAL VISUAL INSPECTION
12.1Is the controlled Work Instruction displayed for the operator at final visual station ?1
12.2Is the operator inspect the critical point, location, assy. bad on the Work Instruction?1
12.3Is the customer defect/complaint (if any) summaries and highlighted ?1
1
12.4Is the operator parate the rejected board and make the identity before nd it to Rework/repair in
convension ?
12.5Does the result inspection for total output being recorded for FPY performance ?1
12.6Inspect the pasd boards with minimum sampling quantity, and check the rejected boards (if
1
available), score '0' for undefined label of rejection.
12.7Does the pasd board packing/wrap properly when it submit to next level ?1
13. OUT GOING INSPECTION
13.1Is the controlled Work Instruction displayed for the operator at OQA inspection station ?1
13.2Is the operator inspect the critical point, location, assy. bad on the Work Instruction?1
13.3Is the Customer spec. involved at the inspection instruction? (if available)1
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13.4Does the AQL inspection established and appropriate with model inspected ?1
13.5Is the customer defect/complaint (if any) summaries and highlighted ?1
1
13.6Is the unit inspect under the proper light, magnifying or microscope define on Work Instruction the
product requirement ?
13.7Take the minimum sampling for verify the products met requirement:1
a) Is the Label rial attached properly ?1
b) Is the Solder anomalies met requirement ? (Refer to IPC-610D)1
c) Is stamp ICT,FCT, FVI, AOI, Rework avaliable ? Verify the stamp uniformity location.1
d) Is the component orientation, alignment correct ?1
e) Is the board free contamination (cleaning sufficient) ? Verify the units.1
f) Is date code prent on board, location, legible and correct ?1
13.8Is the communication conducted when the nonconforming find ? CAR, NCR, etc.1
1
13.9Inspect the pasd boards with minimum sampling quantity, and check the rejected boards (if
available)
13.10In ca of Rework submission, Is the OQC perform the 100 % inspection ?
1
Score '0' for sampling u.
13.11Does the data inspected per sampling record and maintained for traceability retained1
Score Score[Document number listed] 14. PACKING
1
14.1Is the controlled Work Instruction displayed for the operator at packaging station ?
The packaging list established ? .
1
14.2Is the any method to maintain packing area to ward off messy or disarrangement ?
At least the FIFO or chain link system is provided.
1
14.3Does the packing material (box/carton, bubble bag, antistatic bag, etc) part number listed on the
Work Instruction or standard operating procedure ?
1
14.4Review the packing, does the packing met requirement ? (check the units inside box with minimum
sampling)
a) Is carton box correct (part number, size) ?1
b) Is the bubble bag, antistatic bag correct and prent ?1
c) Is the board direction correct inside box ?1
d) Is the label box model name, part name, customer
1
name, quantities, date, signet ?
e) Are the actual quantities appropriate with label ?1
f) Is the label patched after the unit inrt ted and before laed the box ?1
f) Is the packaging aled properly ?1
14.5Is the loo box notified and recorded ?1
a) Is the support part/material determined for loo box and documented ?1
14.6Does the packaging result recorded and maintain ?
1
The retention time may required for tracebility of customer feedback or complaining.
MAXIMUM SCORE 147147
OBTAINED SCORE 1470
OBTAINED %100%0%
PASSED %80%80%
OUT COME Pass Fail
Note for Out Come :
- Pass (Result ≥ 85%) ; When the requirements reached ba appropriate with audit checklist
- Conditional Approval (Result < 85% and ≥ 75%); When the some actual are not met requirements and
the Corrective action is required to clo and Work Instructionll review upon CAR's submitted.
- Fail ; If the requirement ba audit checklists cannot reach the minimum score and need to re-audit for finding
after the corrective action done within time constraint not over into next schedule
Ref: QEP-GEN-006
