专利名称：Metallized vias in polyimide
发明人：Loretta J. O'Connor,Romary A. Previti-Kelly,Thomas J. Reen
申请号：US08/349350
申请日：19941205
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公开号：US05552638A
or公开日：
ocean park
19960903
rop专利内容由知识产权出版社提供
英文感谢信摘要：A process for producing a plurality of metallized vias in a polyimide dielectric is disclod. The process includes depositing a polyimide precursor, then a silane and finally a metal, after patterning the polyimide and silane. The sandwich is heated to completely imidize the polyimide, crosslink the silane and anneal the metal simultaneously. The excess metal overlying the polyimide between the vias is removed by chemical mechanical polishing using the crosslinked silane as a polish stop.
什么是分式
申请人：INTERNATIONAL BUSINESS MACHINES CORPORATION家长怎样与孩子沟通
代理机构：Heslin & Rothenberg, Pnpc是什么意思
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