Etchant and array substrate having copper lines et

更新时间:2023-05-20 04:39:35 阅读: 评论:0

wolfgang amadeus mozart
专利名称:Etchant and array substrate having copper
nutslines etched by the etchantivory
吉拉尼发明人:Gyoo-Chul Jo,Ki-Sung Chae
申请号:US10015650
申请日:20011217碧昂丝 女儿
公开号:US06780784B2sherry是什么意思>交大昂立教育
英语四级听力
公开日:
20040824
专利内容由知识产权出版社提供
正在初始化专利附图:
摘要:A method of forming an array substrate for u in a thin film transistor liquid crystal display (TFT-LCD) device includes forming a first metal layer on a substrate,
patterning the first metal layer to form a gate line and a gate electrode extended from
the gale line, forming a gate insulation layer on the substrate to cover the patterned first metal layer, forming an active layer on the gate insulation layer and over the gate electrode, forming an ohmic contact layer on the active layer, forming a cond metal layer on the gate insulation layer to rover the ohmic contact layer and the active layer, forming a third copper metal layer on the cond metal layer, simultaneously patterning the cond metal layer and the third copper metal layer to form a double-layered data line, a double-layered source electrode and a double-layered drain electrode using an etchant that includes hydrogen peroxide (HO), a HOstabilizer, and a neutral salt, and forming a pixel electrode contacting the double-layered drain electrode.
申请人:LG. PHILIPS LCD CO., LTD.
代理机构:Morgan, Lewis & Bockius LLP
更多信息请下载全文后查看am是什么意思

本文发布于:2023-05-20 04:39:35,感谢您对本站的认可!

本文链接:https://www.wtabcd.cn/fanwen/fan/78/703137.html

版权声明:本站内容均来自互联网,仅供演示用,请勿用于商业和其他非法用途。如果侵犯了您的权益请与我们联系,我们将在24小时内删除。

标签:专利   知识产权   出版社   内容
相关文章
留言与评论(共有 0 条评论)
   
验证码:
推荐文章
排行榜
Copyright ©2019-2022 Comsenz Inc.Powered by © 专利检索| 网站地图