Product Specification 产 品 规 格 书

更新时间:2023-05-19 07:38:59 阅读: 评论:0

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Part Number.1121-23001-101 Date2008-08-22 Document No.CEN08015B-A Page  1 / 10
Product Specification
产品规格书
Prepared by:Beny yao
制定:
Checked by:Beny yao
审核:
Approved by:Daniel Yu
核准:处理英文
Part Number.1121-23001-101 Date2008-08-22 Document No.CEN08015B-A Page  2 / 10
1. SCOPE(适用范围) (3)
2. REFERENCE DOCUMENTS(参考文件) (3)
3. FEATURE & DIMENSIONS (特征及尺寸) (3)
3.1. PRODUCT DIMENSION(产品尺寸) (3)
3.2. PCB/PANEL LAYOUT (印刷电路板布局) (3)
3.3. MATERIAL(材料) (4)
3.4. MECHANICAL & ELECTRICAL CHARACTERISTIC (机械及电气特性) (4)
3.5. PACKAGING(包装) (4)
3.6. MARKING(标识) (4)
3.7 TRANSPORTATION(运输) (4)
3.8 STORAGE(存贮) (4)
4. ENVIRONMENTAL(环境要求) (5)
4.1. SOLDERABILITY(可焊性) (5)
4.2. RESISTANCE TO SOLDER HEAT(耐焊接热) (5)
4.2.1. Wave Soldering (波峰焊) (5)
4.2.1.1. Preheat(预热) (5)
4.2.1.2. Soldering(焊接) (5)
4.2.1.3. Cool Down (冷却) (5)
4.2.2. INFRARED REFLOW(红外线回流焊).............................................................. . (5)
4.2.2.1. Preheat(预热)........................................................................................ . (5)
4.2.2.2. Soldering(焊接)...................................................................................... . (5)
4.2.2.3. Cool Down (冷却).................................................................................... .. (5)
4.3. CLEANING (清洗) (5)
5. PERFORMANCE AND TEST DESCRIPTION (性能及测试) (6)
5.1. REQUIREMENT(要求) (6)
5.2. TEST CONDITION(测试条件) (6)
5.3. SAMPLE SELECTION(样品选择) (6)
5.4. TEST SEQUENCE(测试顺序) (6)
exhibit6. QUALITY ASSURANCE PROVISIONS (品质保证) (6)
TABLE I:PERFORMANCE REQUIREMENTS .......................................7~8 TABLE II:PRODUCT QUALIFICATION TEST SEQUENCE (9)
TABLE III:REFLOW SOLDERING PROFILE (10)
suite
Part Number.1121-23001-101 Date2008-08-22 Document No.CEN08015B-A Page  3 / 10
PRODUCT SPECIFICATIONsometimes
1. SCOPE(适用范围)
This product specification defines the product performance and the test methods to ascertain the
performance of the SD CARD., which is designed and manufactured by CMK
本产品规格书规定了由旭竑电子设计生产的 SD CARD连接器产品的特性及测试方法.
2. REFERENCE DOCUMENTS(参考文件)
MIL-STD-1344A Test method for electrical connector (电子连接器测试方法)
MIL-STD-202F Test method for electrical components (电子零件测试方法)
EIA364 Test method for electrical components (电子零件测试方法)
JIS C 0051 Test method for electrical components (电子零件测试方法)
客户经理竞聘演讲稿
MIL-G-45204C Specification for gold plating (镀金规格)
IEC-512-3 IEC standard for current carrying capacity tests(IEC电流测试标准)
QQ-N-290A Specification for nickel plating (镀镍规格)
MIL-P-81728A Specification for tin/lead plating (镀锡铅规格)
MIL-T-10727B Specification for tin plating (镀锡规格)
UL498 UL standard for safety of attachment plug and receptacle(UL安规要求标准)
EN/ISO5961 Determination of total lead & cadmium content ( 总铅和总镉含量测定)
EN1122 Determination of total lead & cadmium content ( 总铅和总镉含量测定)
EN13346 Determination of heavy metals content ( 重金属含量测定)
EPA3052 Determination of total lead & cadmium content ( 总铅和总镉含量测定)
3. FEATURE & DIMENSIONS (特征及尺寸)
3.1. PRODUCT DIMENSION (产品尺寸)
The connectors shall have the dimensions as shown in customer drawing。
本产品的相关尺寸参见客户图面。
3.2. PCB/PANEL LAYOUT (印刷电路板布局)
The recommended PCB layout is shown in customer drawing。
本产品适用的PCB layout参见客户图面。
Part Number.1121-23001-101 Date2008-08-22 Document No.CEN08015B-A Page  4 / 10
3.3. MATERIAL (材料)
The harmful material can follow the requirement of RoHS.
本产品使用的材料符合 RoHS 指令要求。
3.4. MECHANICAL & ELECTRICAL CHARACTERISTIC (机械及电气特性)
The connector shall have the mechanical and electrical performance as described in table I:
本产品的机械及电气特性见附表I。
3.5. PACKAGING (包装)
Products shall be packaged according to requirements specified in purcha order for safe delivery.
Products required tray or carrier tape should meet the proper specification per purcha order.
Connector container and the packaging specification is shown in customer drawing。
产品包装可依客户指定要求。本产品采用卷带包装,具体规格见客户图面。
3.6. MARKING(标识)
Manufacturer’s name, industry recognized logo, or customer approved marks。
标示制造商的名称,或客户认可的相关标志。
3.7.TRANSPORTATION (运输)
Any vehicle can be adopted for the transportation, but moisture-proof and no mechanical damage.
可采用任何运输工具运输,勿淋湿及机械性损伤。
3.8.STORAGE (存贮)
richmediaTemperature: -25℃~+85℃,Relative humidity: ≤80%,Not to storage in corrosive environments A re-qualification test shall be conducted immediately while the storage duration exceed 6 months.
温度:-25℃~+85℃;相对湿度:≤80%;勿贮存于腐蚀环境内。贮存期超过6个月后需重新进行品质确认。
韩国网站网址Part Number.1121-23001-101 Date2008-08-22
Document No.CEN08015B-A Page  5 / 10
4. ENVIRONMENTAL(环境要求)
4.1. SOLDERABILITY(可焊性)
Connector’s solderability can meet MIL-STD-202F standard. Finish shall be free of contaminants.
产品可焊性符合 MIL-STD-202F 标准规定的相关要求,表面不得有污染物.
4.2. RESISTANCE TO SOLDER HEAT (耐焊接热)
4.2.1. Wave Soldering (波峰焊)
out of sightConsists of three concutive phas. 包括三个连续的阶段完成;
4.2.1.1. Preheat(预热)
Increa in temperature not to exceed 4℃per cond. Final preheat temperature will be within
125℃of solder temperature. 温度增加不超过4℃/秒,最终预热温度不超过125℃.
4.2.1.2. Soldering(焊接)
Device leads will be expod to solder wave at 250℃for a maximum of 5 conds.
设备中的引导焊接温度最高250℃不超过5秒.
4.2.1.3. Cool Down(冷却)
Cool down in ambient air at approximately 20℃to 25℃. 冷却到周围环境温度20℃~ 25℃.
4.2.2. INFRARED REFLOW (红外线回流焊)
Three cycles. Each cycle consisting of three concutive phad. 三个周期,每个周期包括三个
连续的阶段完成;
4.2.2.1. Preheat(预热)
Increa in temperature not to exceed 4℃ per cond. 温度增加不超过4℃/秒,
4.2.2.2. Soldering(焊接)
Maximum allowable time above reflow temperature of 183 ℃ is 90 conds. Maximum
bowl怎么读temperature in this interval is 250℃, not to exceed 10 conds. 回流焊温度183℃以上的时最
长不超过 90秒. 最高温度250℃时间不超过10秒.
4.2.2.3. Cool Down(冷却)
Cool down shall not exceed 6℃ per cond. 冷却速度不超过6℃/秒. Note:(注)Device
temperature measurements are referenced from the top-center of the package outer surface.
设备温度量测时以从顶部中间位置测量为准;
4.3. CLEANING (清洗)
Connectors resist to cleaning process. Aqueous Cleaning: Three cycles; each cycle consisting of a
maximum of one minute exposure to 54℃ to 66℃ demineralized tap water at a maximum pressure of 30 psi; followed by air drying for 60℃to 90 conds at 93℃ to 121℃.
产品本身可以承受清洗制程. 水洗:包含三个循环;每个循环包括以下:以最大压力30帕,温度 54
℃~ 66℃,去除矿物质的水,用水龙头冲洗最多一分钟,然后用温度 93℃~121℃的空气吹60到90秒;
Part Number.1121-23001-101 Date2008-08-22
Document No.CEN08015B-A Page  6 / 10
5. PERFORMANCE AND TEST DESCRIPTION (性能及测试)
5.1. REQUIREMENT(要求)
Product is designed to meet electrical, mechanical, and environmental performance requirements
specified in Table I.
本产品设计符合附表一所列的机械,电气及环境要求.
5.2. TEST CONDITION (测试条件)
Unless otherwi specified, all tests shall be performed at ambient environmental conditions. 除非
特别注明,所有测试在室温条件下完成;
5.3. SAMPLE SELECTION (样品选择)
Test samples shall be lected at random from current production. No test samples shall be reud.
Samples are pre-conditioned with 10cycles of durability. Each group shall be containing 5 test
samples.
测试样品从现生产的产品中随机抽取,所有测试过的样品不得重复使用. 样品已预先插拔10次,每组测试有5个样品;
5.4. TEST SEQUENCE (测试顺序)
Products qualification test quence as shown in Table II.
产品品质测试顺序见附表二.
6. QUALITY ASSURANCE PROVISIONS (品质保证)
Comtek is responsible for the quality of the part as it is delivered to customer. Failing lots will be return or other supplier corrective action.
旭竑对出给客户的所有产品品质负责,不良批次的产品退回或由供应商做矫正;

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