milka
专利名称：WAFER MOLDING FOR CHIP-ON-WAFER ASSEMBLY教师节快乐英语
发明人：KELLY, Michael G.,HINER, David
Jon,HUEMOELLER, Ronald Patrickcalendaryear>业余自考
申请号：US2013/068540
申请日：20131105
公开号：WO2014/078133A1
sandstone公开日：
20140522only if
专利内容由知识产权出版社提供
专利附图：
高一英语必修一课文翻译>options and futures摘要：Methods for temporary wafer molding for chip-on-wafer asmbly may include bonding one or more miconductor die to an interpor wafer, applying a temporary
mold material to encapsulate the bonded die, and backside processing the interpor, which may be singulated to generate asmblies comprising the bonded die, the interpor die, which may be bonded to packaging substrates. The temporary mold material may be removed and the bonded die may be tested. Additional die may be bonded to the asmblies bad on the electrical testing. The interpor may be singulated utilizing one or more of: a lar cutting process, reactive ion etching, a sawing technique, and a plasma etching process. The backside processing may compri thinning the interpor wafer to expo through-silicon-vias (TSVs) and placing metal contacts on the expod TSVs. The die may be bonded to the interpor utilizing a mass reflow or thermal compression process.
申请人：AMKOR TECHNOLOGY, INC.
代言人英文地址：85286 US
国籍：US
代理人：MICHEL, Erick J.
check out是什么意思更多信息请下载全文后查看
