专利名称：WAFER LEVEL PACKAGING METHOD AND PACKAGING STRUCTURE
发明人：LUO, Hailong，罗海龙,DROWLEY, Clifford Ian，德劳利·克里夫splendid
申请号：CN2018/113103
申请日：20181031
公开号：WO2020/047973A1
公开日：
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20200312
专利内容由知识产权出版社提供
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专利附图：
原版摘要：A wafer level packaging method and packaging structure. The wafer level packaging method compris: providing a device wafer integrated with a first chip, the
device wafer comprising a first front face integrated with the first chip and a first back face opposite to the first front face; forming a first oxide layer on the first front face; providing a cond chip to be integrated, the cond chip having a face to be bonded; forming a cond oxide layer on the face to be bonded; providing a bearing substrate; temporarily bonding the surface of the cond chip facing away from the face to be bonded onto the bearing substrate; by means of the cond oxide layer and the first oxide layer, implementing the bonding of the cond chip and the device wafer by using a fusion bonding process; after the bonding of the cond chip and the device wafer is implemented, debonding the cond chip and the bearing substrate; and forming a packaging layer covering the cond chip on the first oxide layer. The prent invention improves the bonding strength between the first oxide layer and the cond oxide layer by means of the fusion bonding process, thereby improving packaging finished product rate.
今天你穿秋裤了吗申请人：NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION，中芯集成电路（宁波）有限公司
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地址：Building 3, Building 4 and Building 5, 335 Anju Road, Xiaogang Street, Beilun District Ningbo, Zhejiang 315800 CN，中国浙江省宁波市北仑区小港街道安居路335号3幢、4幢、5幢, Zhejiang 315800 CNhook up
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代理人：INTEBRIGHT LLP，上海知锦知识产权代理事务所（特殊普通合伙）
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