专利名称：WIRE BONDING METHOD 发明人：HASEGAWA TAKESHI
荏苒什么意思>delight
申请号：JP16669781
申请日：19811019
蒙妮坦公开号：JPS5867034A
公开日：
reporter
junwang
consult19830421
专利内容由知识产权出版社提供
方案英文
里约热内卢英文
摘要：PURPOSE:To provide a wire loop form that is always made uniform automatically, by a method wherein falling length is calculated by a computer, and a wire holding clamper is lowered for the length calculated form a wire loop. CONSTITUTION:Data for wire loop height (a), the difference in level between the first bonded point 1 and the cond bonded point 2 and the length in the horizontal direction (c), and for the height of capillary when the wire supporting clamper is clod at the upper port of the cond bonding point are input beforehand in a micro computer. The falling length of the wire supporting clamper that is as less as the falling length of the capillary is calculated by the computer by using the previously input data. The wire loop 3 is formed by making the wire clamper falling by the value calculated by the computer. If (a) for the height of wire loop, and (b) for the height of the cond bonded 2 is assumed bad on the wire loop-form first bonded point 1, the results for a>b, a 申请人：SHINKAWA:KK
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