MPX5010Rev 11, 01/2007
Freescale Semiconductor Technical Data
© Freescale Semiconductor, Inc., 2007. All rights rerved.
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPX5010/MPXV5010G ries piezoresistive transducers are state-of-the-art monolithic silicon pressure nsors designed for a wide range of applications, but particularly tho employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.
Features
• 5.0% Maximum Error over 0° to 85°C
•Ideally Suited for Microprocessor or Microcontroller-Bad Systems
•Durable Epoxy Unibody and Thermoplastic (PPS) Surface Mount Package •Temperature Compensated over –40° to +125°C •Patented Silicon Shear Stress Strain Gauge
•Available in Differential and Gauge Configurations
•Available in Surface Mount (SMT) or Through-hole (DIP) Configurations Application Examples •Hospital Beds •HVAC
•Respiratory Systems •Process Control
ORDERING INFORMATION
Device Type Options Ca No.MPX Series Order No.Packing Options Device Marking SMALL OUTLINE PACKAGE (MPXV5010G SERIES)Basic Elements Gauge, Element Only, SMT 482MPXV5010G6U Rails MPXV5010G Gauge, Element Only, DIP 482B MPXV5010G7U Rails MPXV5010G Ported Elements Gauge, Axial Port, SMT 482A MPXV5010GC6U Rails MPXV5010G Gauge, Axial Port, DIP 482C MPXV5010GC7U Rails MPXV5010G
Gauge, Axial Port, SMT 482A MPXV5010GC6T1Tape & Reel
MPXV5010G
Gauge, Side Port, SMT 1369MPXV5010GP Trays MPXV5010G Gauge, Dual Port, SMT 1351MPXV5010DP Trays MPXV5010G
UNIBODY PACKAGE (MPX2202 SERIES)Basic Element
Differential 867MPX5010D —MPXV5010D Ported Elements Differential, Gauge 867C MPX5010DP —MPXV5010DP Gauge 867B MPX5010GP —MPXV5010GP
Gauge, Axial 867E MPX5010GS —MPXV5010D Gauge, Axial PC Mount 867F MPX5010GSX —MPXV5010D
MPX5010
MPXV5010G SERIES
study abroadUNIBODY PACKAGE PIN NUMBERS (1)
1.Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
1V out 4N/C 2Gnd 5N/C 3
V S
6
N/C
SMALL OUTLINE PACKAGE
PIN NUMBERS (1)
1.Pins 1, 5, 6, 7, and 8 are internal device
一对一少儿英语connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
1N/C 5N/C 2V S 6N/C 3Gnd 7N/C 4
V out
8
N/C
MPX5010Sensors
Figure 1. Fully Integrated Pressure Sensor Schematic
Sensing Element
Thin Film Temperature Compensation
and Gain Stage #1Gain Stage #2
and Ground Reference Shift Circuitry
V S
V out
GND
Pins 1 and 5 through 8 are NO CONNECTS for surface mount package
Pins 4, 5, and 6 are NO CONNECTS for unibody package
Table 1. Maximum Ratings (1)
1.Exposure beyond the specified limits may cau permanent damage or degradation to the device.
Rating
Symbol Value Unit Maximum Pressure (P1 > P2)P max 75kPa Storage Temperature T stg –40 to +125°C Operating Temperature
come homeT A
–40 to +125
°C
MPX5010
Sensors
Table 2. Operating Characteristics (V S = 5.0 Vdc, T A = 25°C unless otherwi noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet specification.)
Characteristic
Symbol Min Typ Max Unit Pressure Range (1)1. 1.0 kPa (kiloPascal) equals 0.145 psi.
P OP 0—10kPa Supply Voltage (2)2.Device is ratiometric within this specified excitation range.
V S 4.75 5.0 5.25Vdc Supply Current
I o — 5.010mAdc Minimum Pressure Offt (3)(0 to 85°C)
@ V S = 5.0 Volts 3.Offt (V off ) is defined as the output voltage at the minimum rated pressure.
V off
0.2谷歌中译英在线翻译
0.425
Vdc
Full Scale Output (4)(0 to 85°C)
@ V S = 5.0 Volts 4.Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure.
V FSO
4.475 4.7 4.925Vdc
Full Scale Span (5)(0 to 85°C)
@ V S = 5.0 Volts 5.Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.V FSS
4.275 4.5 4.725Vdc
Accuracy (6)(0 to 85°C)
6.Accuracy (error budget) consists of the following:
•Linearity:Output deviation from a straight line relationship with pressure over the specified pressure
range.
•Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.ray charles
•Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
•TcSpan:Output deviation over the temperature range of 0° to 85°C, relative to 25°C.•TcOfft:Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to
25°C.
•Variation from Nominal:T he variation from nominal values, for Offt or Full Scale Span, as a percent of V FSS , at 25°C.
罪愆———±5.0%V FSS Sensitivity V/P —450—-mV/kPa Respon Time (7)
nforce
7.Respon Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure.t R — 1.0—-ms Output Source Current at Full Scale Output I O+—0.1—-mAdc Warm-Up Time (8)8.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.——20—-ms Offt Stability (9)
9.Offt Stability is the product's output deviation when subjected to 1000 hours of Puld Pressure, Temperature Cycling with Bias Test.
—
—
±0.5
—-
%V FSS
Table 3. Mechanical Characteristics
Characteristics
Typ Unit Weight, Basic Element (Ca 867) 4.0grams Weight, Basic Element (Ca 482)
1.5
grams
MPX5010Sensors
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip.
Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Ca 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the nsor diaphragm.
The MPX5010 and MPXV5010G ries pressure nsor operating characteristics, and internal reliability and
qualification tests are bad on u of dry air as the pressure media. Media, other than dry air, may have adver effects on
nsor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.
Figure 3 shows the recommended decoupling circuit for interfacing the integrated nsor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the power supply is recommended.
Figure 4 shows the nsor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.
Figure 2. Cross-Sectional Diagram SOP
(not to scale)
Figure 3. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, plea refer to
Application Note AN1646.)
Figure 4. Output versus Pressure Differential
Fluoro Silicone Gel Die Coat
Wire Bond Die
P1
Stainless Steel Cap
Thermoplastic
Ca
Die Bond
Differential Sensing
Element
P2
+5 V
1.0 µF
0.01 µF
470 pF
GND
V s
V out
IPS
OUTPUT
Lead Frame
Differential Pressure (kPa)
O u t p u t (V )
5.04.54.03.53.02.52.01.51.00.500
1
2
3
4
5
6
7
8
9
11
10
TYPICAL
MIN
keri hilsonMAX感觉英文怎么说
Transfer Function:
V out = V S *(0.09*P+0.04) ± ERROR V S = 5.0 Vdc
TEMP = 0 to 85°C
MPX5010
Sensors
Nominal Transfer Value:V out = V S x (0.09 x P + 0.04)
± (Pressure Error x Temp. Factor x 0.09 x V S )V S = 5.0 V ± 0.25 Vdc
Transfer Function (MPX5010, MPXV5010G)
MPX5010, MPXV5010G SERIES
Temp Multiplier
–4030 to 851+125
3
Temperature in °C
4.03.0
2.00.0
1.0–40
–20
20
40
60
140
120
100
80
Temperature Error Factor
NOTE: The Temperature Multiplier is a linear respon from 0° to –40°C and from 85° to 125°C.
Temperature Error Band
Pressure Error (Max)Pressure Error Band
0 to 10 (kPa)
±0.5 (kPa)
Pressure (kPa)
0.50.40.2–0.3–0.4–0.5
01
2
3
4
5
6
7
8
9
寒暄赞美0.3
0.1–0.2–0.110
Pressure Error (kPa)
