专利名称：PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
发明人：CHAU, Ellis,CO, Reynaldo,ALATORRE,
Roann,DAMBERG, Philip,WANG, Wei-
shun,YANG, Se, Young,ZHAO, Zhijun
申请号：EP12787211.7
申请日：20121016
公开号：EP2769411A1
公开日：
20140827
专利内容由知识产权出版社提供
摘要：A microelectronic package can include wire bonds having bas bonded to respective ones of conductive elements expod at a surface of a substrate. The wire bonds may have exterior edge surfaces dispod at an angle between 25° and 90° relative to the bas, and ends remote, e.g., opposite, from the bas, and remote from the ends which are connected to the bas. A dielectric encapsulation layer extends from the substrate and covers portions of the wire bonds such that covered portions of the wire bonds are parated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer, the unencapsulated portions including the ends of the wire bonds.
申请人：Invensas Corporation
地址：3025 Orchard Parkway San Jo, CA 95134 US
国籍：US
代理机构：Ahmad, Sheikh Shakeel 更多信息请下载全文后查看
