DIRECT JET IMPINGEMENT-ASSISTED THERMOSYPHON COOLI

更新时间:2023-08-10 15:02:36 阅读: 评论:0

专利名称:DIRECT JET IMPINGEMENT-ASSISTED
THERMOSYPHON COOLING APPARATUS
AND METHOD
发明人:Levi A. CAMPBELL,Richard C. CHU,Michael J.
起立英语
ELLSWORTH, JR.,Madhusudan K.destination是什么意思
IYENGAR,Robert E. SIMONS
申请号:US12491289
申请日:20090625
公开号:US20100328882A1
公开日:归去来兮辞的翻译
20101230
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专利附图:热烈欢迎英文>erar
考试书numberlock摘要:Cooling apparatus and methods are provided for facilitating cooling of an electronic device utilizing a cooling subasmbly, a pump and a controller. The cooling subasmbly includes a jet impingement structure, and a thermosyphon. The jet impingement structure directs coolant into a chamber of the subasmbly onto a surface to be cooled when in a jet impingement mode, and the thermosyphon, which is associated with the chamber, facilitates convective cooling of the surface to be cooled via boiling of coolant within the chamber when in a thermosyphon mode. The controller, which is coupled to the pump to control activation and deactivation of the pump, also controls transitioning between the jet impingement mode and the thermosyphon mode bad on a nd temperature of the electronic device.
申请人:Levi A. CAMPBELL,Richard C. CHU,Michael J. ELLSWORTH, JR.,Madhusudan K. IYENGAR,Robert E. SIMONS
sarsaparilla地址:Poughkeepsie NY US,Poughkeepsie NY US,Poughkeepsie NY US,Poughkeepsie NY US,Poughkeepsie NY US
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国籍:US,US,US,US,US
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