WIRE BONDER
UTC-2000
SHINKAWA LTD.
Development Concept of UTC-2000
1.Improve Productivity
–Bonding speed enhancement 67ms/2mm ⇒ 60ms/2mm 2.Fine pitch bonding capability enhancement
–Pad pitch 40µmPP ⇒35µmPP
3.Taking care of stacked device
–Ultra low loop CSP-Loop mode
4.Machine reliability enhancement六一主持词
Features of UTC-2000
•Improve Productivity
–Bonding speed enhancement
20022003200420052006
70ms/wire
60ms/wire
UTC-1000
70ms
Super 67ms
UTC-2000
UTC-200060msbrought
2007
Improve UPH
•Comparison under same conditions Pad奥尔布赖特
Lead
S-Level(um)10070S-Speed(mm/s)1119Bond Force (gf)2530US Time (ms)44
Loop Mode SQRa
Capillary CD=43 H=33 FA=8 (TOTO)
Au Wire TANAKA GLF 25um Temp.240℃
Sample
QFP 240pin(SHINKAWA STD-5)
规则英文By optimizing parameters,you can get better result.
Parameters
Conditions
protectiveUTC-2000
133 units
UTC-2000133 units UTC-1000 Super
第四军医大学研究生院115 units
UTC-1000 Super 115 units 15 %!
Improved
UTC-1000
106 units
UTC-1000106 units 25%!
Improved
Bonding Speed 60 ms/2mm
10
20
30
40
50口号英语
60
Z-Speed
US
Z-Level
UTC-2000Bonding Speed
60 ms
UTC-2000Bonding Speed 60 ms UTC-1000 Super Bonding Speed
67 ms
UTC-1000 Super Bonding Speed 67 ms US
11%!
Faster
Speed enhancement ofmy pleasure
XYZ-travel
fingering
70ms
night prayer
