专利名称：Lead frame surface finish enhancement 发明人：Jerrold L. King,Syed S. Ahmad,Jerry M.
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申请号：US08/300695
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申请日：19940901五一节的作文
weatherford公开号：US05616953A
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公开日：
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专利内容由知识产权出版社提供
摘要：An multiple lead miconductor integrated circuit package incorporating a silicon die wire bonded to a lead frame plated by high purity copper. The die and the lead frame are encapsulated in an epoxy compound with lead fingers from the lead frame extending outside of the encapsulated compound. The high copper plating on the lead frame, which lead frame is not compod of high purity copper, increas the conductivity thereof so as to improve the signal speed for the lead frame. A thinner copper plating on the lead frame can be ud without a decrea in signal speed as frequency of the signal is incread.
申请人：MICRON TECHNOLOGY, INC.
代理机构：Workman, Nydegger & Seeley
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