专利名称：RESIN INSULATION LAYER FORMATION METHOD, RESIN INSULATION LAYER AND
PRINTED CIRCUIT BOARD
发明人：MATSUMURA Masami，松村 正美,NITA
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Yutaka，二田 完,MATSUMOTO Shigeru，松本
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申请号：JP2015/053505
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lee hom申请日：20150209
公开号：WO2016/006264A1
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公开日：
20160114
专利内容由知识产权出版社提供
thank you什么意思摘要：A formation method of a resin insulation layer which has excellent acid resistance and electroless gold plating resistance and which excels in suppressing copper foil discoloration is provided, as well as a resin insulation layer formed with said formation method, and a printed circuit board having said resin insulation layer. This resin insulation layer formation method involves forming a dry film of a curable resin composition on a substrate and subquently heat-curing said film, and is characterized by involving a step in which the aforementioned heat-curing is performed using nanosized superheated dry steam; the resin insulation layer is formed by said formation method, and the printed circuit board compris said resin insulation layer.
申请人：TAIYO INK MFG. CO., LTD.，太陽インキ製造株式会社
地址：900, Oaza Hirasawa, Ranzan-machi, Hiki-gun, Saitama 3550215 JP,〒3550215 埼玉県比企郡嵐山町大字平澤９００番地 Saitama JP
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国籍：JP,JP
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