专利名称：Lead free bump and its formation method
发明人：下山 正，横田 洋，黄海 冷，栗山 文夫，齋藤 信利
rump申请号：JP2004562939
英语四级听力下载
以上英语申请日：20031225
公开号：JPWO2004059042A1
公开日：
20060427
范玮琪和黑人婚纱照
专利内容由知识产权出版社提供英语辅导报答案
专利附图：
摘要：As for this invention, it regards lead free bump and its formation methodmyhobby>clarify
男生的英语名字
occurrence of the void which is obtained by reflow doing the Sn-Ag bad solder alloy plated membrane which adjusted the Ag density in the plated membrane being
controlled. Lead huiribanpu of this invention forms the Sn-Ag bad alloy membrane of the Ag content which is lower than the eutectoid formation density of Sn-Ag with plating,is obtained by reflow doing the particular alloy plated membrane.
申请人：株式会社荏原製作所
地址：東京都大田区羽田旭町１１番１号
会计进修学院国籍：JP
代理人：渡邉 勇，堀田 信太郎，小杉 良二，森 友宏更多信息请下载全文后查看
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