Chip resistor and manufacturing method thereof

更新时间:2023-07-17 06:08:12 阅读: 评论:0

专利名称:Chip resistor and manufacturing method
口译翻译
质疑英文thereof
发明人:木下 泰治,星徳 聖治,坪田 博典,鹿島 康浩
申请号:JP2017549344
申请日:20170426
perfectionist
公开号:JPWO2017188307A1
公开日:our什么意思
20180517
okc专利内容由知识产权出版社提供天声人语
韩国留学费用
专利附图:
摘要: The chip resistor includes a resistor, first and cond electrodes provided on the lower surface of the resistor, and a protective film provided on the lower surface of the resistor between the first and cond electrodes . The resistor includes a first recess extending from the lower surface and extending along the first end surface and not
reaching the upper surface and a cond recess extending from the lower surface and extending along the cond end surface and not reaching the upper surface And a recesd portion are provided. The first and cond electrodes are located between the first and cond recess. The protective film is provided between the first and cond electrodes. A cond plating layer in which the first plating layer is provided over the inner surface of the first concave portion and the first electrode is provided over the inner surface of the cond concave portion and the cond electrode There. This chip resistor can reduce the possibility of mounting failure.
申请人:パナソニックIPマネジメント株式会社
地址:大阪府大阪市中央区城見2丁目1番61号
cuc
国籍:JP
手表的英文代理人:鎌田 健司,前田 浩夫
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