EPR-Executive Plan Review
SCAR-Supply China Asssment Review
SCRR-Supply China Readiness Review
EOW-Early Open Window
MDRR-Manufacturing Development Readiness Review
SS-Ship Support
SDV-System Design verification
SIT-System Integration Test
SVT-System Verification Test
SOVP- Start of Volume Production
DOI-Days of inventory
ostaDOA --- Defective On Arrival 货物一到就发现有质量问题，因此客户退机TTV-Time to volume
MDRR-Manufacturing Development Readiness Review
SKU-Stock Keeping Unit
SOW-Scope of work
MPM-manufacture project manager
IOD-integrated offerring delivery
ODT-Offering delivery team
PDT-product development team
PTC-purcha technology center
NRE-non-recurring engineering
PIDT-portfolio investigation decision team
FRU-field replaced unit
GA-general availability
AVAP-assign vendor assign price
BTO-build to order
BTS-build to storage
CTO- configure to order(ship to end customer)
PBCA-preliminary bom change authorization ：使用時機
:
量產前 BOM的建立、審核、與發行，以及此階段的
設計變更管理
New BOM Creation
Engineering Change before MP
DIMM-Dual-Inline-Memory-Modules
HDMI-High Definition Multimedia Interface
PCMCIA端口-Personal Computer Memory Card International Association PCH-Platform Controller Hub
GPU-Graphics Processing Unit
VRAM-Video RAM
CRT-Cathode Ray Tube
LCD-Liquid Crystal Display
LVDS-Low Voltage Differential Signal eDPjennifer lawrence
LAN-Local Area Network
EC：Embedded Controller
BIOS-Basic Input Output System
NVIDIA稱之為GPU: Graphics Processing Unit
RAM: Random Access Memory，隨機存儲器.
SP口:Serial Port，串行接口
AFT-Asmbly Function Test
OBE-Out of Box Evaluation
ORT-On-going Reliability Test, 持续的可靠性测试（MP和Pre-MP）
EOP: End Of Production
PJE
MLC -Material Life Cycle Management
PSM -Product Structure Management
EDM -Enterpri Document Management
TR-Transistor
PCR---Product Change Request
PBM --- Procurement Brand Manager 采购品牌及项目管理部
PBM-product/brand manager
FFC 柔性扁平电缆 Flexible Flat Cable
WIFI-wireless fidelity
TFT LCD (Thin Film Transistor Liquid Crystal Display)
MRB的全称是Material Review Board
RF）是Radio Frequency
MLC(material Lifecycle Control 是管理仁寶物料從料
號申請，審核，承認，變更到Pha out的一系列作業流
程與資料的管理與追蹤.
EDM (Enterpri Document Management)文件管理主
要提供圖面與文件電子化管理
PSM (Production structure management))是管理仁寶
BOM從申請，審核，變更的一系列作業流程與資料的管
理與追蹤.
Unified Memory Architeture简称UMA DIS-Discrete
一般就是指没有独立显卡的机器，在主板上集成了显卡，集成的显卡需要使用内存来作为显存GPM(Green Part Management System) -Owner: Safety
EDC: Engineering Document Center
SRQCM ( Schedule, Resource, Quality, Cost, Material)
ECO:Engineering Change Order
SCR: Supplier Change Request
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PCR---Product Change Request
Annotation:BOM草稿golo
§ECC(Enterpri change control ) are including below contents：
−DCR (Design Change Request)：使用時機在BOM正式版發行之後，由RD自發性的設計變更(Design Change, 2nd Source, BOM error, DOC update…)或客戶需求的設計變更
−SCR (Supplier Change Request) ：使用時機量產後，採購單位針對材料之Shortage, EOL, Second Source, Spec. Change…等，對RD提出之Change Request
−EAR (Engineering Action Request)：使用時機量產後,RD和采購以外之單位針對Product Design Iss
ue, BOM error, 零件代用,BOM移製程對RD提出之Change Request
−INV (Investigation) ：使用時機量產後，針對 Design Change, Second Source, Material Revision Change…等做小批量試投或批量的試產
玻璃杯的英语
−ECR (Engineering Change Request) ：使用時機量產後，凡產品牽涉變更事項(如Engineering Change, Engineering Note, Spec. Change, Production Process Note…等)，需獲得客戶認可之變更
−SECO (Standard Engineering Change Order) ：使用時機在BOM正式版發行之後，凡牽涉Design Change,
2nd Source, BOM error, DOC update之變更
−CECO (Component Engineering Change Order) ：使用時機設計類零件經正式承認使用後，須對零件規格變更者
google 翻译PIM:part information management : 物料资讯与生命周期管理，是管控物料品质的资本作业平台PSM: product structure management : for BOM 从申请，审核，变更等一系列作业管理。
PBCR 量产前BOM 变更管理 : Preliminary BOM change request
GCM :Global Commodity Manager
NTF: no trouble found
MOSFE:Metal-Oxide -Semiconductor Field Effect Transisto金属氧化物半导体场效应晶体管
RE test : radiated emission
EMEA --- Europe Media East and Africa, 欧洲、中东、非洲
MTMM--- Machine type machine model(机型号）例如847871X，830552A。
PJE-- Project Engineer(專案工程師)
Annotation: BOM草稿
FFC ---Flexible Flat Cable柔性扁平电缆俗称排线FPC--Flexible Printed Circuit board 挠性印刷电路板俗称软板
UNBW 未估价的物料
SED: sub-system engineer division
lna是哪个国家的缩写MSD元件 Moisture-Sensitive Device
AUO 友达光电
BOE 京东方
CMI 奇美
LGD LG display
Innolux 群创光电
SGD 三星
RFI --- Request For Information
RFQ --- Request For Quote
eDP : Embeded disply port
安徽会计从业资格考试报名POR: Plan of record
SWG:standard wire ga(u)ge 标准线规
统一内存架构 (Unified Memory Architeture简称UMA) DIMM
Dual-Inline-Memory-Modules 的简称，双列直插式存储模块
Gasket 导电泡棉
UMA （核显版本） Unified Memory Architeture ：一般就是指没有独立显卡的机器，在主板上集成了显卡，集成的显卡需要使用内存来作为显存。这种做法就被称为统一内存架构，即UMA
SWG （双显卡）
TDP :Thermal Design Power 散热设计功耗
TPM(Trusted Platform Module)安全芯片，是指符合TPM(可信赖平台模块)标准的安全芯片，它能有效地保护PC、防止非法用户访问
APS:Active protection system APS（Active Protection System，主动保护系统），是由内嵌于主板上的加速度感应芯片和内嵌于CPU和预装在系统中的震动预测管理软件所组成
WiDi(Intel WirelessDisplay)全称为无线高清技术NGFF是一个比mSATA还要小巧的SSD接口。busted
POST : power on lf test 自检
MPN: manufacture part number
TAPS: 临时承认书
MWA: material waiver authorization
MSD: Green material substance declaration 绿色材质成分宣告书
MTD :Mechanical Technical Dept
LD :Line Director
OM :order management
PMC :Prodcution Control Director
SIT :System Image Technology
cosplayerSA :Software Application
SED :Subsystem Engineering Dept.
EC :Embedded Control
DFB:Design for Board
DFM:Design for Mechanic
DFT:Design for Testing
GD :Graphic Design
GCM:Global Commodity Manager
