专利名称：Single-core two-side substrate with u-strip and co-planar signal traces, and power and
闻官兵收河南河北ground planes through split-wrap-around
研究所英文(SWA) or split-via- connections (SVC) for
packaging IC devicesstream
发明人：John H. Lau,Yung Shih Chen,Tai-Yu
Chou,Frank H. Wu,Kuan Luen Chen,Wei H.
Koh
申请号：US08/795478
申请日：19970211
公开号：US05825084A
调遣
公开日：
六级词组
英语早教机构19981020
专利内容由知识产权出版社提供
摘要：The prent invention disclos a new substrate with two metal layer circuit structure and layout for miconductor packaging. The speed and performance characteristics of the miconductor device are optimized while the packaging structure is simplified by utilizing only one dielectric layer and conventional printed circuit board fabrication process. The difficulties encountered due to the complexities and higher cost of production required for the multiple layer and high density configuration are thus avoided. The improved circuit structure is achieved by implementing a gmented ring on one side of a substrate and a split plane on the other side thus fojust beat it歌词
rming a single layer substrate structure. The edges of the substrate are coated with metal layer to provide inter-layer connections. In addition to the benefits of high performance, low cost, the improved circuit structure and package layout provide flexibility allowing higher degree
of freedom for lecting the location and number of input and output signal lines and connections to the ground and power planes from the miconductor device.
申请人：EXPRESS PACKAGING SYSTEMS, INC.
august是什么意思
allowance代理人：Bo-In Lin
早会开场白更多信息请下载全文后查看
