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witnesdStudy of chip strength due to backside grinding on
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期刊名称： Journal of the Chine Institute of Engineers
作者： Chen, Shoulung,Tsai, Cheng‐Zorn,Hung, Kou‐Chan,Wu, Enboa
年份： 2005年
期号： 第5期audio recorder
关键词： chip strength; weak region on wafer; backside grinding; grinding mark
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for this paper using the threepoint bending test method that complies with ASTM standard E855. It was found from thousands of testing results that a weak region in a wafer always exists when the wafer has been thinned by mechanical backside grinding method. This weak region was distributed in two ctori
al regions 45 degrees wide and symmetric to the wafer center. The averaged chip strength in the weak region was found to be at least 30% lower than the averaged chip strength of the whole wafer, and was independent of chip aspect ratio, metallization, diameter
英语口译of the wafer, and the equipment that the backside grinding process ud. The existence of the weak region was due to the grinding mark produced by the equipment, and was physically explained by
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内容由中国教育图书进出口有限公司引进
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