cima专利名称：FLIP CHIP MOUNTING TECHNIQUE
发明人：ESTES, Richard, H.,CLAYTON, James, E.,ITO, Koji,AKITA, Masanori,MORI, Toshihiro,WADA,
Minoru
lacros怎么读申请号：US2001044389increas>blow me a kiss
indie pop申请日：20011128
公开号：WO02/045152P1
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公开日：洒脱的英文
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20020606
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专利内容由知识产权出版社提供
摘要：The invention provides process for bonding a flip chip (1) to a substrate (3) in a manner that maximizes reliability of the bonding operation. Electrically conductive polymer bumps (2) are formed on bond pads (4) of a flip chip (1) and the flip chip polymer bumps (2) are at least partially hardened. Electrically conductive polymer bumps (8) are formed on bond pads (4) of a substrate, and a layer of electrically insulating adhesive paste (5) is then applied on the substrate (3), covering the substrate polymer bumps (8) with the adhesive (5). The bond pads (6) of the flip chip () are then aligned with the bond pads (4) of the substrate (3) and the at least partially hardened flip chip polymer bumps (2) are then pushed through the substrate adhesive (5) and at least partially into the substrate polymer bumps (8). In a further method, electrically conductive polymer bumps (2) are formed on bond pads (6) of a flip chip (1) and the flip chip polymer bumps (2) are at least partially hardened. A layer of electrically insulating adhesive paste (5) is formed on a substrate having bond pads (4), covering the bond pads (4) with the adhesive (5). The bond pads (6) of the flip chip (1) are aligned with the bond pads (4) of the substrate (3), and then the at least partially hardened flip chip polymer
bumps (2) are pushed through the substrate adhesive (5) with pressure sufficient for the flip chip polymer bumps (2) to directly contact and deform the substrate bond pads (4).
申请人：POLYMER FLIP CHIP CORPORATION,TORAY ENGINEERING COMPANY, LIMITED
地址：US,JP
国籍：US,JP
代理机构：LOBER, Theresa, A.
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