担心的英文
专利名称：Top-side Cooled Semiconductor Package
gothika
华尔街英语官网with Stacked Interconnection Plates and
Method
发明人：Kai Liu,Francois Hebert,Lei Shi饰扣
申请号：US12326065
申请日：20081201
公开号：US20100133670A1计算机辅助设计的英文缩写>ignorance
公开日：
20100603
救命的英文专利内容由知识产权出版社提供
专利附图：
madeleine peyroux
摘要：A top-side cooled miconductor package with stacked interconnection plate is disclod. The miconductor package includes a circuit substrate with terminal leads, a
miconductor die atop the circuit substrate, a low thermal resistance intimate interconnection plate for bonding and interconnecting a top contact area of the miconductor die with the circuit substrate, a low thermal resistance stacked interconnection plate atop the intimate interconnection plate for top-side cooling, a molding encapsulant for encapsulating the package except for exposing a top surface of the stacked interconnection plate to maintain effective top-side cooling. The top portion of the stacked interconnection plate can include a peripheral overhang above the intimate interconnection plate. The peripheral overhang allows for a maximized expod top surface area for heat dissipation independent of otherwi areal constraints applicable to the intimate interconnection plate. The stacked interconnection plate can be partially etched or three dimensionally formed to create the peripheral overhang.
申请人：Kai Liu,Francois Hebert,Lei Shi
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地址：Mountain View CA US,San Mateo CA US,Shanghal CN
国籍：US,US,CN
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