专利名称：FLIP CHIP
入党转正发言发明人：Young Seok SHIM,Hyung Ju KIM,Joo Hun深圳贝乐学科英语
新东方英语视频教程PARK,Chang Dug KIM
申请号：US15617425
申请日：20170608
公开号：US20170358546A1
公开日：
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普通青年20171214
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专利附图：
摘要：A flip chip includes a substrate, an electrode pad layer stacked over the
漠然是什么意思substrate, a passivation layer stacked at both ends of the electrode pad layer, an under bump metallurgy (UBM) layer stacked over the electrode pad layer and the passivation
layer, and a bump formed over the UBM layer. The width of an opening on which the passivation layer is not formed over the electrode pad layer is greater than the width of the bump. The flip chip can prevent a crack from being generated in the pad upon ultrasonic bonding.
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申请人：WISOL CO., LTD.
地址：Osan-si KR
国籍：KR
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