专利名称：ELECTRICALLY INTERCONNECTED STACKED DIE ASSEMBLIES
发明人：Simon J.S. McElrea,Lawrence Douglas
Andrews, JR.,Scott McGrath,Terrence
Caskey,Scott Jay Crane,Marc E.
tposRobinson,Loreto Cantillep
horback
申请号：US12124077
申请日：20080520
month的复数公开号：US20080303131A1
公开日：
eeprom
江门翻译公司20081211
专利内容由知识产权出版社提供
tata young专利附图：
摘要：In die stack asmbly configurations successive die in the stack are offt at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.
申请人：Simon J.S. McElrea,Lawrence Douglas Andrews, JR.,Scott McGrath,Terrence Caskey,Scott Jay Crane,Marc E. Robinson,Loreto Cantillep
地址：Scotts Valley CA US,Los Gatos CA US,Scotts Valley CA US,Santa Cruz CA
US,Aromas CA US,San Jo CA US,San Jo CA US澳大利亚留学价格
last but not the least
国籍：US,US,US,US,US,US,US
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