专利名称：Heat transport equipment and electronics
发明人：内野 顕範，上村 拓郎，大山 敦史，渡邊 諒太
申请号：JP2019089251
申请日：20190509
公开号：JP2020188033A
长沙托福报名公开日：
20201119
lehman
专利内容由知识产权出版社提供
gkt专利附图：
hush
摘要：PROBLEM TO BE SOLVED: To provide a heat transport device and an electronic device which are thin, lightweight and have excellent heat transfer characteristics. A heat transport device 11 includes a heat pipe 38 in contact with a CPU 34 and a heat spreader 40 in contact with the heat pipe 38 to dissipate heat. The heat pipe 38 has a heat receiving
detachment
surface 38a in contact with the CPU 34 and a side surface 38b orthogonal to the heat receiving surface 38a. The heat spreader 40 is provided so as to surround the heat pipe 38 and is provided so as to surround the first plate member 44 who side surfaces are thermally connected to each other and the first plate member 44, and the heat pipe of the first plate member 44. It has a cond plate member 46 who side surfaces are thermally connected to each other on the side opposite to the side in contact with 38. The cond plate member 46 is thinner than the first plate member 44. The heat spreader 40 has a connecting plane on the same plane as the facing surface 38c of the heat pipe 38, and is in contact with the inner surface 12Aa. [Selection diagram] Fig. 5申请人：レノボ・シンガポール・プライベート・リミテッド
地址：シンガポール ５５６７４１、ニュウテックパーク、＃０２－０１、ローロンチュアン １５１
六级真题下载>survive用法
国籍：SG
jwong代理人：特許業務法人酒井国際特許事務所
星期一的英文
msf更多信息请下载全文后查看
