专利名称：Silicone composition and thermally英文金额大写
conductive cured silicone producttic toc>biteme>英语培训
米勒时刻
发明人：David Dean Hirschi,Michael Andrew Lutz 申请号：US09796225
申请日：20010228
公开号：US06448329B1
公开日：
20020910
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摘要：A silicone composition for preparing a cured silicone product, the composition comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) an organohydrogenpolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition; (C) an alumina filler in a concentration sufficient to impart thermal conductivity to the cured silicone product; (D) an effective amount product; (D) an effective amount of a polyether; and (E) a catalytic amount of a hydrosilylation catalyst. A cured silicone product comprising a reaction product of the silicon composition.
申请人：DOW CORNING CORPORATION
代理人：Larry A. Milco
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