wow goldIPCWorks2005-
Las Vegas, NV
John Andresakis, Takuya Yamamoto,Kaz Yamazaki-Oak-Mitsui Technologies Yoshi Fukawa, Glenn Bennik-TechDream, Inc.
INTRODUCTION
•Buried Capacitance Drivers
•Material Properties
•PCB Manufacturing Process
•Impedance/Noi Measurements
•Simulation Results
•Further Studies
•Conclusionthis
高中试卷网
High speed computing boards Module boards
Servers, Routers, Super computers Cell phones, PDA, Note book computers CPU processor speed
Operation voltage
Power consumption
Power distribution improvement
Multiple band
More functions
Cost
Miniaturization / HDI
Background / Motivation
Embedded capacitor Embedded capacitor
Background of demand for PCB with Embedded Capacitor
mustbe
新东方总裁
“Thin”power ground plane is the key parameter to improve electrical
performance at high frequency!
⊿V=I*R +L *di/dt
V
Voltage Regulatorzucc
Power Ground
IC
Embedded capacitance layer 0.5 1.0 1.5 2.0 2.5 3.03.5 4.0 4.5 5.0
延胡索酸>latin
Itanium
ITRS 2010
Athalon
Pentium 1486
386
Voltage
P o w e r (W )Voltage is decreasing
Time
Allowable ⊿V is ±5%of Voltage
⊿V Will increa as clock speed increa
50
秦学教育100150wps是什么意思
ITRS, Swaminathan etal.
⊿V<50mV
⊿V<250mV
L ∝Loop area ∝Power ground thickness
⊿V<500mV
Background of demand for PCB with Embedded Capacitor
High capacitance and capacitance uniformity is the key to embed
Source: Richard Ulrich University of Arkansas
Component density is reaching its limit
Passive components
