METHOD AND DEVICE FOR PLATING OF COIL-LIKE PLATING

更新时间:2023-06-21 10:07:06 阅读: 评论:0

disi专利名称:METHOD AND DEVICE FOR PLATING OF COIL-LIKE PLATING OBJECT
实收资本发明人:TANIGUCHI KAZUHIRO预订英文
申请号:JP15792780互动英文
申请日:19801110
金山翻译器公开号:JPS633958B2
holly cow公开日:
take a bow19880126
我的快乐英文
专利内容由知识产权出版社提供
摘要:PURPOSE:To apply plating in such a way that the thickness of plating differ above and below in desired positions by disposing a pair of right and left mask plates within a plating treatment cell, and making the positions in the vertical directions of the mask plates variable with respect to a coil-like plating object. CONSTITUTION:A coil-like plating object 6 is pasd and conveyed in a plating treatment cell 2 in a longitudinally placed state through the slit 7c of the cell 2. The object 6 advances by passing through the inside of the clearance l between a pair of right and left mask plates 11a, 11b. A plating soln. 26 is supplied from plating supply pipes 8a, 8b and nozzles 9 into the cell 2. Both side surfaces 6'a of the object 6 upper than the plates 11a, 11b are plated thickly by electrolysis and the plating soln. 26 flowing out downward through microclearances 25 plates the lower object 6 thinly. It is possible to form thick plating 27 and thin plating 28 simultaneously in desired positions by changing the positions of the plates 11a, 11b properly above the pass line 24.cnh
申请人:NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
更多信息请下载全文后查看
tube

本文发布于:2023-06-21 10:07:06,感谢您对本站的认可!

本文链接:https://www.wtabcd.cn/fanwen/fan/78/1004992.html

版权声明:本站内容均来自互联网,仅供演示用,请勿用于商业和其他非法用途。如果侵犯了您的权益请与我们联系,我们将在24小时内删除。

上一篇:BIPOLAR COIL
下一篇:DBL DB LECTRO M4S
标签:资本   专利   全文   下载   知识产权   出版社   内容
相关文章
留言与评论(共有 0 条评论)
   
验证码:
推荐文章
排行榜
Copyright ©2019-2022 Comsenz Inc.Powered by © 专利检索| 网站地图