thermally

专利名称：THERMALINTERFACEMATERIALS

发明人：YongJoonLee,a,Nicolo

Brambilla,DanielRich

申请号：US17165363

申请日：20210202

公开号：US2A1

公开日：20210819

专利内容由知识产权出版社提供

专利附图：

摘要：erialincludes:asheet

extendingbetweenafirstmajorsurfaceandacondmajorsurface,thesheetincluding:a

bamaterial;ematerialmay

embodiments,

thethermallyconductiveelementsarepreferentiallyorientedalongaprimarydirection

fromthefirstmajorsurfacetowardsthecondmajorsurfacetopromotethermal

embodiments,the

embodiments,thethermal

conductivityofthesheetalongtheprimarydirectionisatleast20W/mK,30W/mK,40

W/mK,50W/mK,60W/mK,70W/mK,80W/mK,90W/mK,100W/mK,ormore.

申请人：FastCAPSystemsCorporation

地址：BostonMAUS

国籍：US

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