boiling

专利名称：Boilingenhancementcoating

发明人：SeungMunYou,JohnP.O'Connor

申请号：US08/716227

申请日：19961202

公开号：US05814392A

公开日：19980929

专利内容由知识产权出版社提供

摘要：Acoatingcompositioncomprisingaglue,aparticulatematerialandasolvent,

whichimpartsasurfacemicrostructuretoacoatedobject(29)

particulatematerialprojectsabovetheglueline(28)ofthecoatedobjectcreatingthe

ontally

oriented,rectangularsurfaceimmerdinFC-72,indicatesuptoan85%decreain

incipientsuperheat,a70%to80%reductioninnucleateboilingsuperheats,.

109%increainthecriticalheatflux(CHF),

enhancedsurfaceheattransfercoefficientsarefourtoninetimeshigherthanthofrom

tingsareapplicabletoelectroniccomponentsurfaces.A

coatedsilicontestchiptestedatsubcooled(45°ionsusingFC-72hadheat

dissipationratesof˜100W/.85°C.,andthe

highestCHFobrvedwas159W/.2,224%higherthanthatfromtheuntreated

chipsurfaceatsaturatedconditions.

申请人：BOARDOFREGENTS,THEUNIVERSITYOFTEXASSYSTEM

代理机构：Arnold,White&Durkee

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