专利名称:TypeMoldsmoldinglaminationand
moldingmethod
发明人:岡原悦雄
申请号:JP特願平10-198602
申请日:19980714
公开号:JP特許第3520772号(P3520772)B2
公开日:20040419
专利内容由知识产权出版社提供
摘要:PROBLEMTOBESOLVED:Toobtainamoldandamoldingmethodforrestoring
adecorationlayerdamagedduringmolding,especially,thedecorationlayerofthe
surfaceparalleltotheclampingdirectionofthemoldduringamoldingcyclewhenaskin
materialhavingaresindecorationlayerislaminatedtothemoltenresinofacore
ON:Inalaminatemoldingmethodintegratinga
skinmaterialhavingaresindecorationlayerastheoutermostlayerwiththemoltenresin
ofacorematerialbyinjectionmoldingorpressmoldingtomoldaskinlaminatedresin
moldedproduct,oorlowerthan
edduringmoldclampingbyadecorationpartislectedasthe
decorationlayeroftheoutermostlayerand,
ecorationlayeroftheskin
moldclamping,thecavitysurfaceofthemold
comingintocontactwiththedesignsurfaceofthedecorationlayeroftheskinmaterialis
allowedtoretreatbyatleastonemovablecoretoprovideagapbetweenthecavity
surfaceofthemoldandthedecorationlayeroftheskinmaterial.
申请人:宇部興産株式会社
地址:山口県宇部市大字小串1978番地の96
国籍:JP
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