thickness

专利名称：Coatingthicknessmeasurementmethodand

grindingmethod

发明人：多賀稜,田中佑宜

申请号：JP2019091683

申请日：20190514

公开号：JP2020188130A

公开日：20201119

专利内容由知识产权出版社提供

专利附图：

摘要：【Task】Anobjectoftheprentinventionistoprovideacoatingthickness

measuringmethodcapableofstablymeasuringthecoatingthickness,andagrinding

methodcapableofimprovingthethicknessaccuracyofthewaferaftergrinding.

SOLUTION:Alongfilm,aresin,andawaferarelaminatedinthisorder,andthefilmand

theplatenhavingaflatsurfacearepresdsoastobeincontactwitheachothertocure

theresin,wherebythesurfacecontainingthefilm,theresin,andtheresinisformed.A

methodofformingalaminateinwhichaflatcoatingandthewaferarelaminated,and

measuringthethicknessofthecoatingwithanopticalnsoratapluralityof

cknessofthe

coatingissuchthatatleastonediameterdirectionformeasuringthethicknessofthe

coatingonthewaferisdifferentfromtheMDdirectionandtheTDdirectionofthelong

dformeasuringthethicknessofacoatingfilmformeasuringthethickness.

[Selectiondiagram]Fig.4

申请人：信越半導体株式会社

地址：東京都千代田区大手町二丁目２番１号

国籍：JP

代理人：好宮幹夫,小林俊弘

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