collagen

专利名称：Collagensponge

发明人：中田研,佐藤幸宏,池田大介,藤本一朗

申请号：JP2014553573

申请日：20140214

公开号：JP5909610B2

公开日：20160427

专利内容由知识产权出版社提供

摘要：Providedisacollagenspongehavingacompressivestrength(stress)

equivalenttothatofthetissuetobeimplanted,havingnoirregularityinstructureand

stress,lagendispersion,solution,

ormixtureofcollagenhavingacollagenconcentrationof50mg/mlormoreis

insolubilizedafterlyophilization,hasastressof10to30kPaatastrainof10%load,and

hasaporestructureonthesurfaceandinsideAcollagenspongehavingaporehavingan

averagediameterintherangeof50to400mandastandarddeviationofthepore

diameterof80%orlessoftheporeaveragediameterhasacompressivestrength

(stress)equaltothatofthetissuetobeimplantedIthasaporestructuretohaveuneven

structureandstressandtoinfiltratecells.

申请人：国立大学法人大阪大学,株式会社高研

地址：大阪府吹田市山田丘１番１号,東京都文京区後楽１丁目４番１４号

国籍：JP,JP

代理人：庄司隆,資延由利子,大杉卓也,曽我亜紀

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